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Advanced Circuit Boards Workshop in UK June 27
June 15, 2018 | IMAPS-UKEstimated reading time: Less than a minute
On June 27, IMAPS-UK, with the support of the National Physical Laboratory (NPL), will hold a one day workshop/colloquia on the topic of advanced circuit boards. Attendees will learn about specialist substrates, PCB design theory and methods for pushing the envelope with the latest design rules, and much more.
The workshop will cover all aspects of PCBs and other substrates for advanced applications where miniaturisation, shape, current handling, speed, signal integrity and challenging environments are affecting your application.
For more information, click here.
Suggested Items
Embedded World 2024: Rohde & Schwarz Presents its Cutting-edge Test Solutions for Embedded Systems
03/27/2024 | Rohde & SchwarzEmbedded systems are the foundation of today’s electronic devices, spanning sectors as diverse as consumer electronics, telecommunications, industrial, medical, automotive and aerospace applications.
Reassessing Surface Finish Performance for Next-gen Technology, Part 2
03/04/2024 | Frank Xu, PhD and Martin Bunce of MacDermid Alpha, and John Coonrod of Rogers Corp.The introduction of 5G/6G has created a growing demand for faster rates of data transfer and operation at higher frequencies, pushing signals to travel toward the outer edges of conductors. As a result, the surface finish applied over the copper circuitry is now gaining more attention.
Beyond Design: Embedded Capacitance Material
02/22/2024 | Barry Olney -- Column: Beyond DesignEmbedding components into the multilayer PCB substrate can have many benefits, including reduced board size and improved signal integrity. However, embedded capacitance material (which is not really a component but rather part of the substrate) can improve power integrity dramatically by reducing AC impedance and generally enhancing the performance of the product. It takes up no additional space, is easy to implement (because it is compatible with standard FR-4 processes), and can be cost-effective.
RoBAT Brings TDR Test to Bare and Assembled PCBs
02/19/2024 | Andy Shaughnessy, Design007 MagazineIn an interview at DesignCon, Gregory Miczek, global applications manager with RoBAT, discussed the company’s background and its expansion path from backplane defect analyzers to TDR testers for high-tech bare and assembled boards.
Connect the Dots: Controlled Impedance and Calculations for Microstrip Structures
12/28/2023 | Matt Stevenson -- Column: Connect the DotsModern high-speed and RF PCB design is an exciting field but comes with its own set of challenges. Signal integrity, performance, and crosstalk become major concerns. Designers for these types of projects need to learn how to control electromagnetic interference (EMI) and compatibility (EMC), which means utilizing some interesting math and calculations.