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IPC launched a global survey of original equipment manufacturers (OEMs) in the electronics industry this week. This confidential survey is part of a global data collection effort for the development of IPC’s 2018 PCB Technology Trends study. The deadline for OEM survey responses is July 6.
The OEM survey covers technical requirements that support the development of products using the Internet of Things, artificial intelligence, sensor inputs and neural networks, and key technical issues including frequency and reliability. Technical requirements for PCBs are covered, including such properties as thickness, layers, line width and spaces, aspect ratios, I/O pitch, thermal properties, materials and finishes.
Respondents may answer the questions that relate to their type of operations, focusing on one specific end-use application such as automotive, communications, computers, consumer, defense and aerospace, industrial, or medical and instrumentation. OEM participation is crucial to the success of this project, which will provide valuable guidance to the electronics supply chain to meet the current and future needs of OEMs.
A global survey of PCB fabricators will also be launched later this month to collect data from PCB fabricators on their current technical capabilities and the potential for expanded capabilities over the next five years. Together the data on OEM specifications and PCB capabilities will produce detailed aggregate data on the current and future state of circuit board technology and OEMs’ technical requirements, and the outlook for future technology developments through 2023.