Metcal to Exhibit at SMTA Ohio Valley Expo


Reading time ( words)

Metcal will exhibit its Connection Validation (CV) Soldering System with new hand-pieces, Digital Hot Air Pencil and Solder Tip Cleaner, at the SMTA Ohio Expo & Tech Forum, scheduled to take place July 12, 2018 at the Embassy Suites Cleveland Rockside in Cleveland.

Built on the company's SmartHeat technology used in all Metcal soldering systems, CV evaluates the quality of the solder joint by calculating the intermetallic compound formation and providing closed-loop feedback to the operator, mitigating risk in the process. Metcal will introduce the latest CV system accessories at the show, a full set of hand-pieces including tweezers, desolder and high thermal demand that will transform the CV-5200 soldering system into a complete rework solution. Additionally, Metcal has released the CV Monitoring Software that will improve solder process traceability and create a performance baseline to quickly analyze soldering performance, identify changes in solder conditions, and allow users to make changes to their process.

The new Digital Hot Air Pencil was developed for very small surface mount component and package sizes (1206s and smaller) and low board densities. Metcal's Solder Tip Cleaner, meanwhile, features a replaceable brush system that pulls excess solder away from the tip into a removable collection tray for disposal while removing oxidation from the tip, thereby extending the life of the solder tip.

About Metcal

Metcal is a benchtop solutions expert that has delivered broad value to customers since its Silicon Valley beginnings in 1982. Offering unrivalled performance, risk mitigation, and ROI, we give electronics manufacturers in automotive, aerospace, medical devices and military sectors the tools—and the confidence—they need to develop faster, safer, more advanced products. Metcal provides advanced technology products across hand soldering, convection rework, fume extraction, and fluid dispensing applications. For more information, click here.

Share


Suggested Items

IMPACT Washington D.C., 2018 with Juki Automation’s Bill Astle

08/01/2018 | Patty Goldman, I-Connect007
I-Connect007's Patty Goldman caught up with Juki Automation’s Bill Astle during a luncheon on the last day of IMPACT Washington D.C., 2018. As a first-time attendee, Bill came away feeling like he made the right connections with key members of Congress, and he looks forward to returning to the event in the future.

Jigar Patel on ZESTRON’s Reliability Solutions for Class 3 Assemblies

06/14/2018 | Patty Goldman, I-Connect007
At the SMTA West Penn Expo, I had a chance to discuss a paper presented by Jigar Patel, senior application engineer at ZESTRON. Jigar explained some of the cleaning challenges with newer components and how ZESTRON helps optimize cleaning processes for their customers.

Tempo Automation: Setting the Pace for Low-Volume, Quick-Turn Assembly

01/31/2018 | Patty Goldman, I-Connect007
Jesse Koenig, co-founder and VP of technology at PCB assembly company Tempo Automation, discusses with I-Connect007's Patty Goldman how they are making electronics development much easier and more seamless for customers.



Copyright © 2018 I-Connect007. All rights reserved.