SMTA Capital Chapter’s Expo and Tech Forum Set for August 23


Reading time ( words)

The SMTA Capital Chapter is holding it Capital Expo and Tech Forum at Johns Hopkins University/Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, Maryland on Thursday, August 23.

This year’s keynote speaker Geoffrey Doyle, Director of Business Development for Jabil Additive, will present the hot industry topic “Additive Manufacturing Corporate Development.” In addition the Capital Chapter will host technical presentations by Kuprion Inc., KIC and Indium Corporation titled “Versatile Nanocopper Materials-System for High Performance Printing, Assembly and Packaging,” “Industry 4.0 the Next Industrial Revolution – The Smart Factory,” and “Avoiding the Pitfalls of Voiding in PCB Assemblies” respectively.

Please join us for this great networking and free educational event. Registration opens at 8:00 AM and includes a complimentary lunch on the show floor.  Exhibits are open from 9:00 AM until 3:00 PM and the first technical presentation will start at 8:30 AM.

8:00 AM - Registration
9:00 AM  - Exhibits Open
8:30 – 9:15 AM - Technical Presentation – Alfred Zinn, Kuprion Inc. (Versatile Nanocopper Materials-System for High Performance Printing, Assembly and Packaging)
9:45 – 10:30 AM - Keynote Speaker – Geoffrey Doyle, Jabil Circuit Inc. (Additive Manufacturing Corporate Development)
11:00 – 11:45 AM - Technical Presentation – MB Allen, KIC (Industry 4.0 the Next Industrial Revolution – The Smart Factory)
12:00 – 1:00 PM - Complimentary Lunch
1:30 – 2:15 PM - Technical Presentation – Kim Flanagan, Indium Corporation (Avoiding the Pitfalls of Voiding in PCB Assemblies)
2:45 PM - Partner/Exhibitor Recognition and Bingo Door Prizes
3:00 PM - Exhibits Close

To register online to attend or exhibit, please click here.

About Surface Mount Technology Association (SMTA)

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. For more information or to join, please click here.

Share

Print


Suggested Items

Congratulations to Steve Pudles! IPC Hall of Fame 2020 Inductee

02/20/2020 | Patty Goldman, I-Connect007
With over 32 years spent working with IPC, Steve Pudles was elected to the IPC’s Hall of Fame this year. Patty Goldman spoke with Steve about how he first became involved as well as his time in the organization, including his work with the EMS Management Council.

Solder in PCBA: Can’t Live Without It... or Can We?

02/17/2020 | Joe Fjelstad, Verdant Electronics
For most of its historical use in electronics, the solder alloy of choice was tin-lead, either an Sn60/Pb40 alloy or the Sn63/ Pb37 eutectic version of the tin-lead alloy. These two alloys were the workhorses of the industry. They were both well understood in terms of their processing and reliability—that is, until the advent of lead-free, a well-meaning but ill-conceived and poorly executed conversion, forced on the industry by the European Union in 2006.

True or False: CFX Edition

02/06/2020 | David Bergman, vice president, Standards and Training, IPC
Early in 2019, IPC published IPC-2591— Connected Factory Exchange (CFX), Version 1.0. This standard was developed by the IPC Connected Factory Initiative Subcommittee over a two-year period to address issues with machine-to-machine communication and provide the electronics manufacturing industry with a true plug-and-play system for any company to achieve Industry 4.0.



Copyright © 2020 I-Connect007. All rights reserved.