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Test Research Inc. (TRI) will exhibit its comprehensive smart factory inspection solutions for PCB and SMT lines, combining 3D solder paste inspection (SPI), 3D automated optical inspection (AOI), 3D automated x-ray inspection and multi-core ICT at NEPCON South China 2018, which will be held at the Shenzhen Convention & Exhibition Center on August 28-30, 2018. TRI will be in Booth 1H55.
TRI's lineup for NEPCON South China 2018 will include the TR7700Q 3D AOI and the TR7500QE high-performance 3D AOI, designed for zero-escape industry applications, the cutting-edge 3D SPI TR7007Q that features optical resolution of 5.5µm, Stop-and-Go 3D SPI, and the TR7007 SII Plus. TRI's lineup will also include first-class 5µm High-Resolution 3D CT AXI TR7600F3D and TR7600 SIII. TRI's all new TR5001Q SII INLINE Multi-core ICT and TR5001T SII TINY will be both featured during the exhibition.
Discover how TRI's PCBA Test and Inspection solutions work to bring you maximum value in the production line and minimize quality costs. Visit us at NEPCON South China 2018 booth 1H55 for a personal tour of TRI's acclaimed solution lineup.
TRI offers the most robust product portfolio in the industry for automatic test and inspection solutions. From solder paste inspection (SPI), automated optical inspection (AOI), and 3D automated X-ray inspection (AXI) systems to Manufacturing Defect Analyzer (MDA) and in-circuit test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more here.