TRI to Unveil One-Stop Solution for SMT Lines at NEPCON South China 2018


Reading time ( words)

Test Research Inc. (TRI) will exhibit its comprehensive smart factory inspection solutions for PCB and SMT lines, combining 3D solder paste inspection (SPI), 3D automated optical inspection (AOI), 3D automated x-ray inspection and multi-core ICT at NEPCON South China 2018, which will be held at the Shenzhen Convention & Exhibition Center on August 28-30, 2018. TRI will be in Booth 1H55.

TRI's lineup for NEPCON South China 2018 will include the TR7700Q 3D AOI and the TR7500QE high-performance 3D AOI, designed for zero-escape industry applications, the cutting-edge 3D SPI TR7007Q that features optical resolution of 5.5µm, Stop-and-Go 3D SPI, and the TR7007 SII Plus. TRI's lineup will also include first-class 5µm High-Resolution 3D CT AXI TR7600F3D and TR7600 SIII. TRI's all new TR5001Q SII INLINE Multi-core ICT and TR5001T SII TINY will be both featured during the exhibition.

TRI.jpg 

Discover how TRI's PCBA Test and Inspection solutions work to bring you maximum value in the production line and minimize quality costs. Visit us at NEPCON South China 2018 booth 1H55 for a personal tour of TRI's acclaimed solution lineup.

About TRI

TRI offers the most robust product portfolio in the industry for automatic test and inspection solutions. From solder paste inspection (SPI), automated optical inspection (AOI), and 3D automated X-ray inspection (AXI) systems to Manufacturing Defect Analyzer (MDA) and in-circuit test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more here

Share

Print


Suggested Items

Mentor and Seica Partner for Data Prep and Testing Big Boards

01/18/2019 | Pete Starkey, I-Connect007
Mark Laing, business development manager of the Valor division at Mentor, a Siemens company, and Luca Corli, director of sales at Seica, speaks with I-Connect007 Technical Editor Pete Starkey about the partnership between their two companies, which enables efficient data preparation for testing big boards, and accelerates new product introduction (NPI) cycles.

Solder Paste Selection/Qualification

01/16/2019 | Stephen Las Marias, I-Connect007
In a recent SMT007 survey, we asked the following question: " What are your challenges when it comes to solder paste selection/qualification?" Here are just a few of the replies, slightly edited for clarity.

AOI Programs with a Magic Click

12/12/2018 | Jens Kokott and Matthias Muller, Goepel electronic
Production runs of 10–1,000 assemblies are everyday life for an EMS provider. But what if important staff are on vacation, and component deliveries are very much delayed? And then the customer is determined to have AOI, but the layout of the assembly is highly customized, making it virtually impossible to use complete library entries. Here's how AOI programs can help you in these scenarios.



Copyright © 2019 I-Connect007. All rights reserved.