Indium’s Pony Liao to Present at CEIA Shanghai Seminar


Reading time ( words)

Indium Corporation’s Pony Liao, area technical manager for Northern China, will share his technical expertise at the CEIA Shanghai Seminar on July 19 in Shanghai, China.

Pony’s presentation, How to Achieve High Reliability in Automotive Electronics, will focus on how to address the unique challenges encountered by automotive electronics assemblers. Topics will include materials for achieving high-performance on first yields, electrochemical reliability, voiding, and coating. He will also share the test results of a new high-reliability alloy.

Indium Corporation will also be exhibiting at the seminar. Their booth will feature low-voiding soldering materials for the automotive market, including Indium8.9HF Solder Paste and Indium10.1HF Solder Paste. Technical experts will be available at the booth to answer questions about the presentation and help resolve customers’ assembly challenges.

Liao provides technical support for Indium Corporation’s electronics assembly materials, semiconductor and advanced assembly materials, and engineered solders and thermal management materials. He has more than 10 years of experience in surface mount technology, specializing in defect prevention, quality continuous improvement, and cost reduction. Liao earned his bachelor’s degree from Tianjin University in mechanical and electronics engineering.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, click here.

Share

Print


Suggested Items

The Effectiveness of 75% IPA/25% DI Extraction Solution on No-clean Flux Residues

06/13/2019 | David Lober and Mike Bixenman, DBA, KYZEN; and Marietta Lemieux and Mark McMeen, STI
The continuous challenge in the electronics industry is to keep up with the demand for smaller, faster, and more reliable electronics. When it comes to cleaning, this rapid development of manufacturing and reliability challenges is juxtaposed with the slow pace of new test method development.

Reflow Your Solder and Your Data for Industry 4.0

06/11/2019 | Nolan Johnson, I-Connect007
I-Connect007 Managing Editor Nolan Johnson recently spoke with KIC President and Founder Phil Kazmierowicz and Manager of Applications and Sales MB “Marybeth” Allen as they each transitioned into new roles in the KIC leadership team. The conversation ultimately turned to the current dynamics in the industry, particularly Industry 4.0 and streamlining processes.

Laserssel Brings High-speed Soldering to New Application Areas

06/10/2019 | Barry Matties, I-Connect007
In this interview with I-Connect007, Denis Barbini, general manager of Laserssel, talks about the company's new laser-selective reflow solution aimed at reducing a typical reflow oven’s 10-minute cycle down to just 10 seconds as well as the overall benefits manufacturers could see from streamlining this process.



Copyright © 2019 I-Connect007. All rights reserved.