-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Tackling the Challenges in Flex Assembly
July 6, 2018 | Stephen Las Marias, I-Connect007Estimated reading time: 1 minute
We recently released the inaugural issue of Flex007 Magazine, which is dedicated to flex system designers, electrical engineers, flex PCB designers, and anyone responsible for integrating flex into their products at the OEM/CEM level. (If you haven’t seen the first issue yet, which features some of the top flex experts sharing thoughts about flex, rigid-flex, and the flex market, click here.)
As my colleague and Flex007 Managing Editor Andy Shaughnessy wrote, it was time to expand our Flex007 Weekly Newsletter into a magazine after seven years due to the increasing use of flex circuits in many electronics applications.
Indeed, the flex printed circuit market continues to be one of the fastest-growing segments of the PCB industry. According to a report by industry analysts Transparency Market Research (TMR), the global market for flexible printed circuits is expected to expand at a CAGR of 11.8% to reach a value of $38.27 billion by 2026, up from about $14.51 billion in 2017. Mainly driving this growth is the significant rise in the consumer electronics industry, led by the growing demand for smartphones, tablets, and LCD displays. Meanwhile, multilayer flex circuits are enjoying a greater demand among products in this sector, and this trend is projected to remain so over the next few years, according to TMR.
While we were planning the launch of Flex007, one of the flex experts we spoke with mentioned that apart from the design and manufacturing of flex printed circuits, a critical challenge that needs attention is assembly. Their flexible nature requires specific strategies for paste printing, chip mounting, soldering—whether reflow, wave, or hand—and rework/repair processes. Which is why, for the June 2018 issue of SMT007 Magazine, we investigate the many challenges in flex circuit assembly and highlight some of the strategies, techniques and best practices to help assemblers deal with flex circuit issues.
To read the full version of this article, which appeared in the June 2018 issue of SMT007 Magazine, click here.
Suggested Items
ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave
03/26/2024 | ITW EAEITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.
Apollo Seiko Presents the Next Frontier in Non-Contact Soldering at 2024 IPC APEX EXPO
03/12/2024 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is pleased to announce plans to showcase its latest advancements at Booth 1408 during the 2024 IPC APEX EXPO, taking place April 9-11, 2024 at the Anaheim Convention Center in California.
Revolutionizing Soldering: Kurtz Ersa to Debut Cutting-Edge Lineup at APEX
03/12/2024 | Kurtz ErsaKurtz Ersa Inc., a leading supplier of electronics production equipment, is pleased to announce plans to showcase its latest advancements and a range of cutting-edge soldering machines at the 2024 IPC APEX EXPO.
Solderstar to Spotlight the Reflow Shuttle with O2 at IPC APEX EXPO 2024
03/11/2024 | SolderStarSolderstar will introduce the newly launched Reflow Shuttle with O2 measurement module. This product promises to redefine soldering process optimization, offering manufacturers unparalleled control and precision.
Murray Percival Co. Empowers Emerald Technologies with Cutting-Edge Ersa Versaflow 4
03/07/2024 | Murray Percival CompanyThe Murray Percival Company, the award-winning leading supplier to the Midwest’s electronics industry, has successfully facilitated the sale of an Ersa Versaflow 4/55 Selective Soldering Machine to Emerald Technologies Saline, MI location, a leading electronics manufacturing service provider.