AIM Solder Receives Best Presentation Awards at SMTA China East Technical Conference


Reading time ( words)

AIM Solder's Dillon Zhu and Derek Wang have received Best Presentation awards for their respective technical sessions at the SMTA China East Technical Conference in Shanghai.

Zhu’s presentation, titled “Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction,” generated great interest among attendees. This study highlighted stencil and reflow modifications that can be deployed to consistently and repeatedly reduce void formation on BTC style devices.

Wang’s presentation focused on AIM’s new REL alloys, which were developed to provide the PCB assembly industry with unique solutions to address the limitations of current industry offerings.

Zhu is a regional technical support manager for AIM and, with over 15 years of experience, is an expert in SMT manufacturing. Since joining AIM in 2008, he has assisted many clients in diagnosing and correcting SMT and wave solder production challenges.

Wang is a technical support manager for AIM Solder. He is an SMTA Certified Engineer and also serves as a SMT Processes Trainer. With over 13 years’ experience in the SMT industry, Wang supports AIM customers in Eastern China.

Share

Print


Suggested Items

Goepel electronic Solutions, Webinar Series, and Trends

06/19/2019 | Barry Matties, I-Connect007
Barry Matties catches up with Matthias Müller to chat about the wide range of test and inspection solutions currently being offered by Goepel electronic as well as the informative webinar series produced by the company to help further educate their customer base and promote technical discussion on a number of topics.

The Effectiveness of 75% IPA/25% DI Extraction Solution on No-clean Flux Residues

06/13/2019 | David Lober and Mike Bixenman, DBA, KYZEN; and Marietta Lemieux and Mark McMeen, STI
The continuous challenge in the electronics industry is to keep up with the demand for smaller, faster, and more reliable electronics. When it comes to cleaning, this rapid development of manufacturing and reliability challenges is juxtaposed with the slow pace of new test method development.

Reflow Your Solder and Your Data for Industry 4.0

06/11/2019 | Nolan Johnson, I-Connect007
I-Connect007 Managing Editor Nolan Johnson recently spoke with KIC President and Founder Phil Kazmierowicz and Manager of Applications and Sales MB “Marybeth” Allen as they each transitioned into new roles in the KIC leadership team. The conversation ultimately turned to the current dynamics in the industry, particularly Industry 4.0 and streamlining processes.



Copyright © 2019 I-Connect007. All rights reserved.