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AIM Solder's Dillon Zhu and Derek Wang have received Best Presentation awards for their respective technical sessions at the SMTA China East Technical Conference in Shanghai.
Zhu’s presentation, titled “Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction,” generated great interest among attendees. This study highlighted stencil and reflow modifications that can be deployed to consistently and repeatedly reduce void formation on BTC style devices.
Wang’s presentation focused on AIM’s new REL alloys, which were developed to provide the PCB assembly industry with unique solutions to address the limitations of current industry offerings.
Zhu is a regional technical support manager for AIM and, with over 15 years of experience, is an expert in SMT manufacturing. Since joining AIM in 2008, he has assisted many clients in diagnosing and correcting SMT and wave solder production challenges.
Wang is a technical support manager for AIM Solder. He is an SMTA Certified Engineer and also serves as a SMT Processes Trainer. With over 13 years’ experience in the SMT industry, Wang supports AIM customers in Eastern China.
Russell Poppe, JJS Manufacturing
Much has been written about the increasing shortages of electronic components such as MLCCs, chip resistors and other semiconductor devices. And the manufacturing industry is now seeing price increases and greatly extended lead times. It seems the situation is likely to get rapidly worse rather than better. What can we do? Read on.
Real Time With... NEPCON South China
At the recent NEPCON South China 2018 event in Shenzhen, Clemens Jargon, VP for Global Dispensing and Asia at Mycronic, discusses I-Connect007's Edy Yu the challenges that customers face on their journey towards Industry 4.0, and how Mycronic is addressing these issues. From jet printing to solder paste inspection, to pick-and-place, Jargon talks about their total solutions that aim to help customers take their production to the next level.
Jason Fullerton, Alpha Assembly Solutions
This paper investigates and compares the performance of no-clean liquid wave soldering fluxes using a commercially available localized extraction and cleanliness testing system, and surface insulation resistance (SIR) testing. Find out which test is suitable for your processes.