High-Speed Selective Soldering from SEHO at NEPCON South China


Reading time ( words)

SEHO Systems GmbH plans to exhibit at NEPCON South China, scheduled to take place Aug. 28-30, 2018 at the Shenzhen Convention & Exhibition Center. The company will showcase the MaxiSelective-HS – the selective soldering system for maximum throughput requirements in Booth 1D10.

The MaxiSelective-HS is high quality soldering solution when short cycle times are required. Parallel processes in the fluxing, preheating and soldering area, simultaneous contact of all solder joints with product specific multi-nozzle soldering tools, and the parallel transfer of the assemblies to the next work station make this the ideal system for mass production.

Two basic machine versions of the MaxiSelective-HS can be equipped with four or six stations working in parallel both offer the flexibility needed to meet your individual production requirements. Additional buffer stations at the inlet and outlet of the machine complete this high-speed system. In order to meet complex production challenges or o respond to increasing manufacturing volumes, the MaxiSelective-HS can be expanded with additional modules or it may be combined with other machine types at a later date.

Of course, the MaxiSelective-HS provides outstanding features for automated process control. Flux quantity monitoring, gradient-controlled temperature profiles, solder level control with automatic wire supply and an automated wave height control are only some of the machine’s highlights.

For further information, please visit SEHO at NEPCON South China here.

Share


Suggested Items

Strategies for Choosing Solder Paste for Successful Electronics Assembly

08/10/2018 | Jason Fullerton, Alpha Assembly Solutions
One common question from solder customers is, "How do I test and evaluate new solder pastes?" Although that seems like it should be a straightforward question with an easy answer, this could not be further from the truth. This article tells more about this, and how to best select solder pastes for your product.

Evaluating the Impact of Powder Size and Stencils on Solder Paste Transfer Efficiency

07/31/2018 | T. O’Neill, C. Tafoya, and G. Ramirez, AIM Metals and Alloys
Building upon an earlier study that focused on solder paste powder size, room-temperature aging and PCB pad and aperture designs, this study continues to investigate powder mesh size, but also examines stencil surface treatments and stencil foil tension.

Flex Circuit Assembly: Challenges and Strategies for Success

07/27/2018 | Stephen Las Marias, I-Connect007
The flexible printed circuit market is on track for growth. But dealing with flex circuits during assembly is very different from rigid PCBs. This article highlights some of the assembly challenges when working with flex circuits, and strategies to address them.



Copyright © 2018 I-Connect007. All rights reserved.