High-Speed Selective Soldering from SEHO at NEPCON South China


Reading time ( words)

SEHO Systems GmbH plans to exhibit at NEPCON South China, scheduled to take place Aug. 28-30, 2018 at the Shenzhen Convention & Exhibition Center. The company will showcase the MaxiSelective-HS – the selective soldering system for maximum throughput requirements in Booth 1D10.

The MaxiSelective-HS is high quality soldering solution when short cycle times are required. Parallel processes in the fluxing, preheating and soldering area, simultaneous contact of all solder joints with product specific multi-nozzle soldering tools, and the parallel transfer of the assemblies to the next work station make this the ideal system for mass production.

Two basic machine versions of the MaxiSelective-HS can be equipped with four or six stations working in parallel both offer the flexibility needed to meet your individual production requirements. Additional buffer stations at the inlet and outlet of the machine complete this high-speed system. In order to meet complex production challenges or o respond to increasing manufacturing volumes, the MaxiSelective-HS can be expanded with additional modules or it may be combined with other machine types at a later date.

Of course, the MaxiSelective-HS provides outstanding features for automated process control. Flux quantity monitoring, gradient-controlled temperature profiles, solder level control with automatic wire supply and an automated wave height control are only some of the machine’s highlights.

For further information, please visit SEHO at NEPCON South China here.

Share


Suggested Items

Greatest Challenges in Soldering

12/12/2018 | Stephen Las Marias, I-Connect007
In a recent SMT007 survey, we asked the following question: "What are your greatest challenges when it comes to soldering?" Here are just a few of the replies, slightly edited for clarity.

Dr. Traian Cucu Discusses Low-Temperature and Lead-Free Soldering

12/14/2018 | Happy Holden, I-Connect007
Dr. Traian Cucu, group leader of the Global Applications and Technologies Expert Group (GATE)—R&D—within Alpha Assembly Solutions, speaks with I-Connect007 Technical Editor Happy Holden about low-temperature and lead-free soldering applications, and the many critical advantages that can achieved by moving to a low-temperature process. They talk about the industry's transition to lead-free, the first, second and third generation of adoption of low-temperature alloys.

Tempo Automation's Open House Raises the Curtain in San Francisco

11/28/2018 | Nolan Johnson, I-Connect007
Based in San Francisco, Tempo Automation specializes in rapid PCB assembly and on low volume production for a wide range of board complexities. It recently held an open house at its brand-new facility in the South of Market (SoMa) district—which is normally restricted under customer non-disclosure agreements as well as International Traffic in Arms Regulations (ITAR) regulations—to customers, vendors, local designers, and government officials.



Copyright © 2018 I-Connect007. All rights reserved.