VJ Electronix to Exhibit at NEPCON South China

Reading time ( words)

VJ Electronix, Inc. will exhibit in Stand 1J45 at NEPCON South China, scheduled to take place August 28-30, 2018 at the Shenzhen Convention & Exhibition Center. The company will demonstrate its XQuik II with AccuCount Technology and Summit 1800i rework system.

The revolutionary XQuik combines a unique imaging technology, offering the highest contrast and resolution with the most powerful automated counting algorithms and material handling for fast, accurate component counting. The XQuik requires no programming or library development for more than 95 percent of all components while providing the greatest accuracy for 01005 and smaller (008004).

With hundreds of installations worldwide, the XQuik has been integrated with all leading MES systems and storage solutions.  Offering much more than just labor savings, XQuik has a very strong return on investment.

VJ2.jpgThe Summit 1800i offers everything customers liked about the Summit 1800 plus more. The rework system provides the highest speed and accuracy for large boards (up to 560 x 762mm). Now available with 80mm component alignment capability, the 1800i is the leading choice for DIMM connectors and CPU sockets.

Recognized as the leader for large components, the Summit 1800i has improved Micro Passive performance, yet remains compatible with existing Summit 1800 processes.

About VJ Electronix

VJ Electronix, Inc. manufactures production ready, automated Rework and X-ray inspection systems with many advanced capabilities. The company frequently provides custom solutions tailored to satisfy specific application requirements. VJ Electronix is a worldwide leader in X-ray Inspection and Rework equipment.

For more information, click here.


Suggested Items

A New Standard for Standards – From Data to Information

09/07/2018 | Dr. Glen Thomas, Creative Electron
The main challenge we have today with our manufacturing standards is that they are deterministic, such as the 30% maximum void per ball for X-ray inspection of BGAs—which determines if a BGA assembly passes or fails. This article proposes a new perspective on setting pass and fail thresholds in the manufacturing line.

DFM: Top Ten PCB Concerns

07/09/2018 | Dan Thau, Millennium Circuits Ltd
DFM—design for manufacturability—is a critically important but often ignored aspect of the PCB design process that directly impacts product quality and reliability. This article will discuss the top 10 DFM concerns that should be part of any design review process.

A Not So Surprising Focus for Flex in the XR Realm

03/14/2018 | Dan Feinberg
Dan Feinberg has been covering augmented, virtual, and mixed-reality for I-Connect007 for the last few years. He recently met with Eric Braddom, VP of Extended Reality (XR) Product Management for Flex, a company that is involved in this disruptive technology. In this interview, Dan and Eric discuss the future of augmented, mixed and/or virtual reality, or as Flex calls it, "extended reality."

Copyright © 2018 I-Connect007. All rights reserved.