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Test Research, Inc.'s (TRI) latest optical inspection and electrical testing solutions will be displayed at productronica India Trade Fair. Visit TRI's Booth #PB55 in hall 3 with the cooperation of TRI's distributor, Test & Research India PVT. LTD., at BIEC, Bengaluru, India, from September 26-28, 2018.
TRI's 2018 lineup features innovative high accuracy and precision 3D AOI and 3D SPI solutions. TRI's new cutting-edge inline high-resolution 3D AOI TR7700Q will be on display. Test Research, Inc. will also showcase 3D SPI TR7007D for accurate low solder bridge inspection with dual digital fringe projectors and smart board warpage control.
Uncover your production line's potential with TRI's PCBA Test and Inspection solutions, and Industry 4.0 data management system, YMS 4.0, Yield Management System 4.0. TRI's systems are designed to interoperate with other manufacturing equipment to minimize downtime, optimize production quality and reduce operator workload. Visit Booth #PB55 in Hall 3 at productronica India 2018.
TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs), In-Circuit Tester (ICT) and Functional Tester (FCT), TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. For more information, click here.