TRI to Showcase High Resolution Inspection at productronica India 2018


Reading time ( words)

Test Research, Inc.'s (TRI) latest optical inspection and electrical testing solutions will be displayed at productronica India Trade Fair. Visit TRI's Booth #PB55 in hall 3 with the cooperation of TRI's distributor, Test & Research India PVT. LTD., at BIEC, Bengaluru, India, from September 26-28, 2018.

TRI's 2018 lineup features innovative high accuracy and precision 3D AOI and 3D SPI solutions. TRI's new cutting-edge inline high-resolution 3D AOI TR7700Q will be on display. Test Research, Inc. will also showcase 3D SPI TR7007D for accurate low solder bridge inspection with dual digital fringe projectors and smart board warpage control.

Uncover your production line's potential with TRI's PCBA Test and Inspection solutions, and Industry 4.0 data management system, YMS 4.0, Yield Management System 4.0. TRI's systems are designed to interoperate with other manufacturing equipment to minimize downtime, optimize production quality and reduce operator workload. Visit Booth #PB55 in Hall 3 at productronica India 2018.

About TRI

TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs), In-Circuit Tester (ICT) and Functional Tester (FCT), TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. For more information, click here.

Share


Suggested Items

Tips to Improve Soldering Tip Life and Reduce Cost

10/10/2018 | Thermaltronics
Whether in production, or repair and rework, the cost of soldering iron tips can be easily overlooked, but with today’s requirement for higher temperatures in lead-free solder applications, the consumption of tips has dramatically increased. This fact, combined with changes in tip design to meet the higher thermal load requirements, has also resulted in escalating tip costs, making tip care a high priority.

What SMT Component Shortages Mean for Design and Manufacturing Engineers

09/13/2018 | Russell Poppe, JJS Manufacturing
Much has been written about the increasing shortages of electronic components such as MLCCs, chip resistors and other semiconductor devices. And the manufacturing industry is now seeing price increases and greatly extended lead times. It seems the situation is likely to get rapidly worse rather than better. What can we do? Read on.

RTW NEPCON South China: Mycronic Discusses Industry 4.0

09/12/2018 | Real Time With... NEPCON South China
At the recent NEPCON South China 2018 event in Shenzhen, Clemens Jargon, VP for Global Dispensing and Asia at Mycronic, discusses I-Connect007's Edy Yu the challenges that customers face on their journey towards Industry 4.0, and how Mycronic is addressing these issues. From jet printing to solder paste inspection, to pick-and-place, Jargon talks about their total solutions that aim to help customers take their production to the next level.



Copyright © 2018 I-Connect007. All rights reserved.