AIM Announces Commitment to Brazil and Alfatec


Reading time ( words)

AIM Solder is pleased to announce its commitment and partnership with Alfatec and the Brazilian market. David Suraski, executive vice president, and Franics Lapierre, vice president, Operations & Administration, visited Brazil last week to affirm that this is an important market to AIM Solder and the company looks forward to nuturing its existing relationships, and building new ones in the future.

Over the past several years, AIM has expanded its presence and support network in Brazil. In 2016, AIM announced the addition of Alfatec Indústria e Comércio Ltda as a licensed manufacturer to meet the growing demand for AIM solder materials within the Brazilian market. Today, locally produced AIM solder paste liquid flux, bar solder, and cored and solid wire solders are available throughout Brazil.  Additionally, customers rely on AIM's local sales and technical support teams in Sao Paulo and Manaus to support them in achieving their manufacturing goals.

AIM also distributes its innovative high reliability, lead-free alloys, REL61 and REL22 in Brazil. REL61 addresses the most challenging issues with today’s common lead-free alloys, specifically voiding, cost, durability and tin whiskers. REL22 has been specifically engineered as an easily processed, exceptionally durable alloy for extreme service environments.

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products,  and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here.

Share


Suggested Items

Strategies for Choosing Solder Paste for Successful Electronics Assembly

08/10/2018 | Jason Fullerton, Alpha Assembly Solutions
One common question from solder customers is, "How do I test and evaluate new solder pastes?" Although that seems like it should be a straightforward question with an easy answer, this could not be further from the truth. This article tells more about this, and how to best select solder pastes for your product.

Evaluating the Impact of Powder Size and Stencils on Solder Paste Transfer Efficiency

07/31/2018 | T. O’Neill, C. Tafoya, and G. Ramirez, AIM Metals and Alloys
Building upon an earlier study that focused on solder paste powder size, room-temperature aging and PCB pad and aperture designs, this study continues to investigate powder mesh size, but also examines stencil surface treatments and stencil foil tension.

Flex Circuit Assembly: Challenges and Strategies for Success

07/27/2018 | Stephen Las Marias, I-Connect007
The flexible printed circuit market is on track for growth. But dealing with flex circuits during assembly is very different from rigid PCBs. This article highlights some of the assembly challenges when working with flex circuits, and strategies to address them.



Copyright © 2018 I-Connect007. All rights reserved.