Indium’s Geoff Wang to Present at IPC Electronics Assembly High-Reliability Tech Conference


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Indium Corporation’s Geoff Wang, area technical manager for SMT, will share his technical expertise at the 2018 IPC Electronics Assembly High-Reliability Technology Conference on August 23 in Chengdu, China.

Wang’s presentation, "The Impact of Solder Materials on Reliability," will show how materials can be used to solve some of the top challenges in the industry, including HIP, NWO, graping, and SIR performance.

Wang is based in Zhongshan, Guangdong, and provides technical support throughout southern China. He has more than a decade of SMT experience.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, click here.

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