Alpha to Present Low-Temp Papers at SMTA China South Technical Conference


Reading time ( words)

Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will present two of its most popular papers “Low Temperature Soldering Using Sn-Bi Alloys” and “Low-Temperature SMT Process Implementation” at the upcoming SMTA China South Technical Conference on August 28, 2018 in Shenzhen, China.

The first technical paper, titled “Low-Temperature Soldering Using Sn-Bi Alloys“ will be presented by Jackson Chan, Senior Technical Services Manager for Alpha Southern China, and illustrates how low-temperature solder alloys are preferred for the assembly of temperature-sensitive components and substrates. The alloys in this category are required to reflow between 170°C and 200°C soldering temperatures. Lower soldering temperatures result in lower thermal stresses and defects, such as warping during assembly, and permit use of lower cost substrates. Sn-Bi alloys have lower melting temperatures, but some of its performance drawbacks can be seen as deterrent for its use in electronics devices. Therefore, the technical presentation will show that non-eutectic Sn-Bi alloys can be used to improve these properties and further align them with the electronics industry specific needs. The physical properties and drop shock performance of various alloys will be evaluated, and their results will be analysed in terms of the alloy composition, including Bi content and alloying additions.

Another paper, “Low-Temperature SMT Process Implementation,“ will be presented by William Yu, Senior Technical Services Manager for Alpha Northern China. This paper will address how low temperature SMT process to enable tremendous component and laminate cost savings. Replacing the costly wave soldering process by a majority of smart adopters of SMT enabled shorter process flows that saved not only energy, but also largely mitigated the damaging effects of thermal shock that often results from wave soldering.

SMTA China South Technology Conference

Date: Tuesday, August 28, 2018
Time: 10:30am -11:05am
Venue: Booth 1A70, Hall 1, Shenzhen Convention & Exhibition Center, Shenzhen, China
Topic: Low Temperature Soldering Using Sn-Bi Alloys
Presented by: Jackson Chan, Senior Technical Services Manager of Alpha Assembly Solutions

SMTA China Oscar Paper 2018

Date: Tuesday, August 28, 2018
Time: 10:40am -11:15am
Venue: Tulip Hall, 6/F, Shenzhen Convention & Exhibition Center, Shenzhen, China
Topic: Low Temperature SMT Process Implementation
Presented by: William Yu, Senior Technical Services Manager of Alpha Assembly Solutions

About Alpha Assembly Solutions

Alpha Assembly Solutions, part of the MacDermid Performance Solutions group of businesses, is the world leader in the development, manufacturing and sales of innovative specialty materials used for electronics assembly, die attach and semiconductor packaging in a wide range of industry segments, including automotive, communications, computers, consumer, power electronics, LED lighting, photovoltaics, and others.

As the electronics industry continues to evolve, Alpha is focused on developing novel and unique processes for solving assembly challenges. Whether traditional electronics assembly, die attach or emerging applications, such as flexible and formable electronics, Alpha designs solutions for manufacturing that looks at how multiple products can interact in the same environment to provide customers with the most effective assembly solution for their application.

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality materials with a focus on sustainability and recycling services. For more information, click here.

RELATED CONTENT:

Share

Print


Suggested Items

The Sun Rises on IPC APEX EXPO 2019

01/28/2019 | I-Connect007
It's sunrise on Monday in San Diego, and IPC APEX EXPO at the San Diego Convention Center is already abuzz with activity. The exhibition hall setup is on schedule to open for business tomorrow morning, January 29th, 2019.

Executive Forum at IPC APEX EXPO 2019 Focuses on Advancing Automotive Electronics

01/15/2019 | Patty Goldman, I-Connect007
Senior-level executives from across the global electronics supply chain will gather to discuss opportunities and challenges facing the rapidly changing automotive electronics industry. With five expert speakers and a powerful keynote from GreenSource VP Alex Stepinski, registration will fill fast.

A Look at Medical Electronics Design and Assembly Challenges

12/26/2018 | I-Connect007 Editorial Team
We recently spoke with Dr. Despina Moschou, lecturer at the University of Bath, as well as Kaspars Fricbergs, VP of global quality, and Tom Reilly, director of marketing and sales operations, of EMS firm Vexos Corp., to learn more about the challenges and opportunities in medical electronics design and assembly, as well as the relevant regulatory and supply chain issues.



Copyright © 2019 I-Connect007. All rights reserved.