Blackfox Recruiting Instructors for Expanded Training Centers


Reading time ( words)

Blackfox Training Institute is currently recruiting instructors. The company has officially expanded its training and certification capabilities by moving into new expanded facilities in Arizona and opening a new facility in Singapore. Blackfox now has centers in Longmont, Colorado; Tempe, Arizona; Guadalajara, Mexico; Penang, Malaysia; and Singapore. Each of these facilities offers the same IPC certifications and Blackfox skill-based certifications as offered at the Colorado headquarters. 

This expansion was essential in order to create an expansion channel for delivering the IPC quality standards and skill-based training and certification to areas of high demand and reduce the travel costs for customers nearby.  Each of the Blackfox training centers have resident Master IPC Trainers as well as Master IPC Trainers that travel the world delivering all of the training programs at their customers’ facilities.

Due to this huge growth spurt, Blackfox is searching for instructors to join in the excitement and to experience the Blackfox difference. Qualifications include; years of hands on experience in electronics manufacturing, teaching experience, and familiarity with the IPC Standards.  Current IPC certifications are a definite plus. Interested candidates should forward their resumes to Sharon at sharonm@blackfox.com.

About Blackfox

Blackfox is the leader in providing quality training systems and custom courses to the electronic manufacturing industry's cutting edge companies as well as individuals that are interested in a career in electronics. Blackfox is also the premier worldwide authorized IPC Training Center, providing all current IPC certifications. For more information, click here.

Share

Print


Suggested Items

Approaches to Overcome Nodules and Scratches on Wire-Bondable Plating on PCBs

07/17/2019 | Young K. Song and Vanja Bukva, Teledyne Dalsa Inc., and Ryan Wong, FTG Circuits
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. This paper details if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful.

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 1)

07/16/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
Since 2006 and the implementation of the RoHS directive, the interest in bismuth-tin solder alloys—whose melting point around 140°C is very desirable because it allows for the use of lower temperature laminate materials and reduces thermal stress on sensitive components—has only increased as the industry has searched for Pb-free alternatives to the chosen standard, SAC305, which melts at considerably higher temperatures than the incumbent tin-lead alloys.

Size Matters: The Effects of Solder Powder Size on Solder Paste Performance

07/08/2019 | Tony Lentz, FCT Assembly
Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. And the question commonly asked is, "When should we switch from Type 3 to a smaller solder powder?" Read more to find out.



Copyright © 2019 I-Connect007. All rights reserved.