Indium to Feature InFORMS Reinforced Solder Preforms at IMAPS 2018


Reading time ( words)

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS, at IMAPS 2018, October 8-11 in Pasadena, California.

Indium Corporation is redefining solder with its InFORMS solder preforms. InFORMS are a composite preform consisting of solder with a reinforcing matrix. This results in:

  • Improved mechanical and thermal reliability
  • Uniform bondline thickness
  • Low-voiding performance

InFORMS do more than just bond two surfaces. These solder preforms are designed to address some specific challenges to the power electronics industry.

InFORMS provide engineers with an enhanced material for the development of more reliable and higher performance modules. Due to the planarity improvements and stand-off tolerances, the package design becomes more predictable. In addition, stronger and more dependable joints allow for high power densities.

Visit Indium Corporation at booth #722.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, click here.

Share


Suggested Items

Survey: Low-Temperature Soldering on PCBAs

11/14/2018 | Stephen Las Marias, I-Connect007
The majority of the respondents in our survey stated that they expect low-temperature soldering to result in higher quality PCBAs.

Investigation on the Assembly Process for m03015 and a Brief Look at m0201 Components

11/14/2018 | David Geiger, Robert Pennings, and Jane Feng, Flex
Components continue to shrink in the SMT world, and the next evolution of passive components includes m03015 (009005) and m0201 (008004). The m03015 and the m0201 components will see primary adoption in products that require further miniaturization, which would be SiPs. These modules would then be assembled into products through attachment, another assembly, or via other interconnect methods. This article explores the development of an assembly process (SMT only) for the m03015 component.

Alpha Assembly Solutions on Training, Education, and Low-Temperature Soldering

11/07/2018 | I-Connect007 Editorial Team
In this interview, Jason Fullerton of Alpha Assembly Solutions discusses the benefits and challenges of low-temperature soldering. He also highlights the biggest concerns he’s currently seeing in the industry, including young engineers lacking hands-on manufacturing experience and training, voiding and head-in-pillow issues, and low-temperature soldering demands.



Copyright © 2018 I-Connect007. All rights reserved.