Indium's Graham Wilson to Present at TEC Lund


Reading time ( words)

Indium Corporation’s Graham Wilson, applications engineer, will give a poster presentation at TEC Lund on September 27 in Lund, Sweden.

Wilson will present High-Power Device Assembly: A Reinforced Matrix Solder Preform Solution for Bondline Control & Increased Reliability. This presentation explores how a solder preform with a reinforced matrix can maintain bondline coplanarity, improve reliability, and reduce the overall cost of ownership for a substrate as compared to current techniques, such as stamped bumps or stitched wire bonds on the substrate.

Wilson is a senior applications engineer for Indium Corporation’s European operations. He supports customers with comprehensive technical advice on the selection, use, and application of solder pastes, fluxes, and engineered solders. He has more than 20 years of experience spanning a number of industries, including a focus on electronics assembly and thermal management. He is certified as a six sigma green belt through the Thayer School of Engineering at Dartmouth and shares his expertise at conferences internationally. Wilson earned his degree in HNC Electronics from the University of Northampton.

TEC Lund features discussions and exhibits on advanced and emerging technologies in printed circuit board design, the current component situation, as well as the latest innovations within electronics assembly technologies. Indium Corporation will also be exhibiting at this event.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, click here.

Share

Print


Suggested Items

SMTAI 2019: Chris Bastecki on Low-temperature Solder Challenges and Products

10/14/2019 | Real Time with...SMTAI
Chris Bastecki, director of global PCB assembly at Indium Corporation, discussed challenges of low-temperature solder and the company's new product, Durafuse LT, which provides novel properties and reliability.

Real Time with... SMTAI 2019 Video Interviews

10/09/2019 | Real Time with...SMTAI
The SMTA International Conference and Exhibition 2019, which took place September 22–26, 2019, at the Donald E. Stephens Convention Center in Rosemont, Illinois, concluded successfully. For those of you who were not able to make it to the show, catch our video interviews with the movers and shakers of the electronics industry. We've updated our video presentation for a better experience for our users, so check it out!

SMTAI 2019: Happy Holden’s On-the-Scene Report

10/03/2019 | Happy Holden, I-Connect007
Last week concluded the 2019 SMTAI conference in Rosemont, Illinois. Overall, I think the show was successful and covered all aspects of SMT processes.



Copyright © 2019 I-Connect007. All rights reserved.