-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Atotech to Present and Exhibit at the 38th IEMT Conference
August 29, 2018 | AtotechEstimated reading time: 2 minutes
Atotech will participate in the 38th International Electronics Manufacturing Technology (IEMT) Conference 2018. Atotech will exhibit in Booth 20 and present the paper “Improving Reliability by Forming a 3D Connection for Quad Flat No-lead ICs using Immersion Tin.” The conference will be held at the Ramada Plaza in Melaka, Malaysia, from September 4 to 6, 2018.
As a keynote presenter, Rick Nichols, Global Product Manager Surface Finishing at Atotech Group, will speak in session D6 on September 6, from 10:30 am to 12:10 pm. “The surfaces of Quad Flat No-lead (QFN) devices are usually electrolytically tin plated on the contacts and heat sink. This technique limits the connection to the bottom surface of the IC and is only two dimensional,” Nichols said. “The incorporation of an immersion tin process will make a 3D connection or fillet possible.”
In his presentation, Nichols will explore the processes required and highlight the main benefits, which are quality enhancement and the potential to improve the reliability of automatic optical inspection (AOI).
Traditionally, the IEMT Conference 2018 focuses on new and future technology trends and intelligent innovations. So, what can one expect from Atotech this year? Atotech announced a special product feature on next generation copper pillar plating and an inventive non-etching adhesion promoter for advanced packaging substrates.
Spherolyte Cu RDL/ Pillar 3
Spherolyte Cu RDL/Pillar 3 is the next generation of high speed copper pillar plating for advanced packaging, permitting high speed pillar plating of up to 4.0 µm per minute. Its primary feature is a pure copper deposition, which is achieved through a lower incorporation of organic impurities of the additive system. This leads to lower void formation at the intermetallic phase and allows the elimination of the nickel plating step. Spherolyte Cu RDL/Pillar 3 also enables flat and recess free pillar plating, even when plating on top of μ-vias.
NovaBond IT
NovaBond IT is a new and innovative non-etching adhesion promoter (NEAP) for inner-layer bonding and soldermask pretreatment. It combines the benefits of a non-etching surface treatment with enhanced peel strength and thermal reliability. This superior performance is achieved on standard ABF build-up films as well as soldermasks and high frequency materials. NovaBond IT promotes the formation of a nano-dimensional copper oxide structure, adding a superb surface area increase to the conductors, but hardly contributing to the surface roughness.
Visitors to the show are invited to stop by and meet the Atotech team at booth number 20 to find out more about the special featured products or simply to discuss future industry and technology trends and innovations with Atotech’s leading experts and specialists on site.
About Atotech
Atotech is one of the world’s leading manufacturers of specialty chemicals and equipment for the printed circuit board, IC-substrate and semiconductor industries, as well as for the decorative and functional surface finishing industries. Atotech has annual sales of USD1.2 billion (2017). The company is fully committed to sustainability – we develop technologies to minimize waste and to reduce environmental impact. Atotech has its headquarters in Berlin, Germany, and employs about 4,000 people in over 40 countries.
Suggested Items
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
ENNOVI Introduces a New Flexible Circuit Production Process for Low Voltage Connectivity in EV Battery Cell Contacting Systems
04/03/2024 | PRNewswireENNOVI, a mobility electrification solutions partner, introduces a more advanced and sustainable way of producing flexible circuits for low voltage signals in electric vehicle (EV) battery cell contacting systems.
Heavy Copper PCBs: Bridging the Gap Between Design and Fabrication, Part 1
04/01/2024 | Yash Sutariya, Saturn Electronics ServicesThey call me Sparky. This is due to my talent for getting shocked by a variety of voltages and because I cannot seem to keep my hands out of power control cabinets. While I do not have the time to throw the knife switch to the off position, that doesn’t stop me from sticking screwdrivers into the fuse boxes. In all honesty, I’m lucky to be alive. Fortunately, I also have a talent for building high-voltage heavy copper circuit boards. Since this is where I spend most of my time, I can guide you through some potential design for manufacturability (DFM) hazards you may encounter with heavy copper design.
Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5
03/19/2024 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite or carbon dispersion are quickly gaining acceptance worldwide. Indeed, the environmental and productivity gains one can achieve with these processes are outstanding. In today’s highly competitive and litigious environment, direct metallization reduces costs associated with compliance, waste treatment, and legal issues related to chemical exposure. What makes these processes leaders in the direct metallization space?