Indium’s Jason Chou to Present at TechXPOT at SEMICON Taiwan


Reading time ( words)

Indium Corporation’s Jason Chou, area technical manager for Taiwan, will share his technical expertise at TechXPOT at SEMICON Taiwan 2018 on September 6 in Taipei, Taiwan.

The system-in-package (SiP) module market has grown significantly over the past several years because this process is capable of packing more functionality into a single package with a smaller form factor. However, SiP assembly presents challenges that impact yields. Chou will present SiP Package Process Challenge and Solution, which reviews an auger electron spectroscopy (AES) analysis that demonstrates how various reflow profiles, metal load, and the component’s surface contamination impact head-in-pillow defects in SiP assembly.

Chou provides technical support to Indium Corporation’s customers in Taiwan with a focus on the semiconductor industry. Chou earned his master’s degree in chemistry from National Tsing Hua University and his bachelor’s degree in chemistry from National Cheng Kung University. He has served as the group leader for the National Nano Device Laboratories in Tainan, Taiwan, where he collaborated with university professors and industry professionals on special projects for semiconductor manufacturing.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, click here.

Share


Suggested Items

What SMT Component Shortages Mean for Design and Manufacturing Engineers

09/13/2018 | Russell Poppe, JJS Manufacturing
Much has been written about the increasing shortages of electronic components such as MLCCs, chip resistors and other semiconductor devices. And the manufacturing industry is now seeing price increases and greatly extended lead times. It seems the situation is likely to get rapidly worse rather than better. What can we do? Read on.

Strengthening the Joint with a Revolutionary New Low-Temp Solder Paste

09/05/2018 | Patty Goldman, I-Connect007
I-Connect007 Editor Patty Goldman interviews one of Alpha Assembly Solution’s solder process experts, Traian Cucu, who is based at Alpha’s R&D center in New Jersey. Traian, along with Morgana Ribas, have played key roles in the development of Alpha’s innovation new low-temperature solder paste process. He also talks about how this solves many of the defects issues that one would see on a SAC assembly process.

KIC’s MB Allen to Present ‘Industry 4.0 the Next Industrial Revolution – The Smart Factory’

08/17/2018 | KIC
KIC announced that MB (Marybeth) Allen will present at the SMTA Capital Expo & Tech Forum, scheduled to take place Thursday, August 23, 2018 at the John Hopkins University/Applied Physics Lab in Laurel, Maryland.



Copyright © 2018 I-Connect007. All rights reserved.