Indium to Show Fine-Feature Solder Paste at productronica India


Reading time ( words)

Indium Corporation will feature Indium11.8HF-SPR solder paste – a new no-clean, Pb-free solder paste designed to meet the current and future fine feature printing requirements of mobile manufacturers – at productronica India 2018, September 26-28 in Bengaluru, India.

Indium11.8HF-SPR specifically addresses customers’ needs for a high-performance solder paste with Type 5 powder. This new solder paste delivers unprecedented stencil print transfer efficiency on the broadest range of processes, while maintaining industry-leading reflow performance.

Indium11.8HF-SPR benefits:

  • Halogen-free per IEC 61249-2-21 test method EN14582
  • High-transfer efficiency through small apertures
  • (≤ 0.66AR)
  • Long stencil life (>12 hours)
  • Eliminates hot and cold slump to inhibit bridging and solder beading defects
  • Avoids the potential for HIP and graping defects with a unique oxidation barrier
  • Reflows in both air and nitrogen

Indium Corporation and MEL Systems and Services Ltd. (MELSS) will share a booth in Hall 3, Booth PA15.

For more information about Indium Corporation, click here.

Share


Suggested Items

Impact of Low-Temperature Soldering on PCBAs

11/14/2018 | Stephen Las Marias, I-Connect007
Majority of the respondents in our survey answered that reliability is the biggest impact of low-temperature soldering on PCBAs. Issues they highlighted include the strength of the solder joints, "uncooked" solder, insufficient solder, and solder not adhering properly, to name a few. However, they did note that once the process becomes mainstream, proven and an industry standard, they expect low-temperature soldering to result to higher quality PCBAs.

Investigation on the Assembly Process for m03015 and a Brief Look at m0201 Components

11/14/2018 | David Geiger, Robert Pennings, and Jane Feng, Flex
Components continue to shrink in the SMT world, and the next evolution of passive components includes m03015 (009005) and m0201 (008004). The m03015 and the m0201 components will see primary adoption in products that require further miniaturization, which would be SiPs. These modules would then be assembled into products through attachment, another assembly, or via other interconnect methods. This article explores the development of an assembly process (SMT only) for the m03015 component.

Alpha Assembly Solutions on Training, Education, and Low-Temperature Soldering

11/07/2018 | I-Connect007 Editorial Team
In this interview, Jason Fullerton of Alpha Assembly Solutions discusses the benefits and challenges of low-temperature soldering. He also highlights the biggest concerns he’s currently seeing in the industry, including young engineers lacking hands-on manufacturing experience and training, voiding and head-in-pillow issues, and low-temperature soldering demands.



Copyright © 2018 I-Connect007. All rights reserved.