-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
Article Highlights
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
K Company Installs Dynachem Automatic Vacuum Lamination Line
September 7, 2018 | DynachemEstimated reading time: Less than a minute
Taiwanese advance substrate manufacturer K Company has purchased an Automatic Vacuum Lamination Line from Dynachem. The latest line is a newer design that incorporate many new features.
The manufacturer, a long-time partner of Dynachem with global distribution of high-end substrate, selected the Dynachem MVC 24-S1 for their new production facility. Two systems were installed and accepted for mass production in November 2017.
MVC (modular vacuum chamber) is the new generation modular machine that provides customer an option to extend the system from single stage to dual stage lamination.
The S1 (Series 1) system uses a silicon belt as the panel introduction into the chamber. This panel transfer method helps customer save substantial amount of operational cost.
Dynachem also supplies the MVC-RTR system that is using a PET reel-to-reel for panel transfer and the MVP (Modular Vacuum Press) for dual-stage lamination.
For more information, click here.
Suggested Items
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation are proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia. on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
Lockheed Martin Successfully Transitions Long Range Discrimination Radar To The Missile Defense Agency
04/23/2024 | Lockheed MartinThe Long Range Discrimination Radar (LRDR) at Clear Space Force Station in Clear, Alaska, completed DD250 final acceptance and was officially handed over to the Missile Defense Agency in preparation for an Operational Capability Baseline (OCB) decision and final transition to the Warfighter. In addition, prior to this transition, the system has started Space Domain Awareness data collects for the United States Space Force.