Free LED Cleaning and Reliability Webinar Hosted by ZESTRON Academy


Reading time ( words)

Zestron will host the LED Cleaning and Reliability” webinar on Thursday, September 27, from 1:30 p.m. to 2:30 p.m. EDT. This is the seventh installment of the Zestron Academy 2018 Cleaning Webinar Series, and will be presented by Senior Application Engineer, Ravi Parthasarathy, M.S.Ch.E.

LEDs are widely used within modern PCBs in high power, automotive and lighting applications. Removing flux residues post soldering is critical in order to maintain functionality. This webinar reviews LED failure mechanisms such as corrosion, electrochemical migration and signal leakage. Customer case studies addressing LED cleaning applications will also be presented.

“We invite both new and experienced industry members to attend this free webinar as we’ll review types of LED packages, reasons for cleaning LEDs and types of failure mechanisms” said Sal Sparacino, sales and marketing manager, Zestron Americas.

About Zestron

Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With eight worldwide technical centers and the largest team of engineers focused on high precision cleaning, Zestron’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.

Share

Print


Suggested Items

'Coatings Uncoated!' Webinar Series and Automotive Industry Trends

04/03/2020 | Real Time with...IPC
Phil Kinner, global business/technical director of Electrolube’s coatings division, tells Pete Starkey about the positive impact of the “Coatings Uncoated!” webinar series and comments on how the company has responded to the changes in the focus of the automotive industry.

Trends From the Show: Solder and Software

03/18/2020 | Nolan Johnson, I-Connect007
In my role as a media representative, my perspective on IPC APEX EXPO may be a bit different from that of many attendees. Since the I-Connect007 team had the opportunity to talk to many attendees and exhibitors and listen to their stories over the course of the week, our view can be particularly wide. When I reflected on all the conversations, pieces from all throughout the week coalesced and provided a different understanding of and takeaway from the show.

Evolving Solder Capabilities for Shrinking Components

03/16/2020 | I-Connect007 Editorial Team
Taiyo’s Yuya Suzuki, marketing manager for IC packaging materials, talks with Nolan Johnson and Dan Feinberg about the challenges with soldering due to shrinking components and how Taiyo’s R&D work around smaller filler sizes and increased planarity has been preparing them for the future of solder mask.



Copyright © 2020 I-Connect007. All rights reserved.