Reading time ( words)
At the recent NEPCON South China 2018 event in Shenzhen, Clemens Jargon, VP for Global Dispensing and Asia at Mycronic, discusses the challenges that customers face on their journey towards Industry 4.0, and how Mycronic is addressing these issues.
From jet printing to solder paste inspection, to pick-and-place, Jargon talks about their total solutions that aim to help customers take their production to the next level.
Share
Suggested Items
MacDermid Enthone to Exhibit and Present at Hong Kong Printed Circuit Association Show 2018
11/21/2018 |
MacDermid Enthone Electronics Solutions
MacDermid Enthone Electronics Solutions to exhibit at HKPCA tradeshow, Shenzhen, China, December 5-7, 2018.
Survey: Low-Temperature Soldering on PCBAs
11/14/2018 |
Stephen Las Marias, I-Connect007
The majority of the respondents in our survey stated that they expect low-temperature soldering to result in higher quality PCBAs.
Investigation on the Assembly Process for m03015 and a Brief Look at m0201 Components
11/14/2018 |
David Geiger, Robert Pennings, and Jane Feng, Flex
Components continue to shrink in the SMT world, and the next evolution of passive components includes m03015 (009005) and m0201 (008004). The m03015 and the m0201 components will see primary adoption in products that require further miniaturization, which would be SiPs. These modules would then be assembled into products through attachment, another assembly, or via other interconnect methods. This article explores the development of an assembly process (SMT only) for the m03015 component.
