RTW NEPCON South China: Mycronic Discusses Industry 4.0


Reading time ( words)

At the recent NEPCON South China 2018 event in Shenzhen, Clemens Jargon, VP for Global Dispensing and Asia at Mycronic, discusses the challenges that customers face on their journey towards Industry 4.0, and how Mycronic is addressing these issues.

From jet printing to solder paste inspection, to pick-and-place, Jargon talks about their total solutions that aim to help customers take their production to the next level.

Watch the interview here.

Share

Print


Suggested Items

Industry Outlook from IPC's Sharon Starr

03/18/2019 | Patty Goldman, I-Connect007
Sharon Starr, IPC's director of market research, provides updates on the EMS and PCB industry outlook, benefits of IPC membership and participation, plans to expand the EMS statistical program, and new studies being published.

RTW IPC APEX EXPO 2019: Reducing Voiding in Reflow Soldering

03/06/2019 | Real Time with...IPC
Chris Nash, product manager for PCB assembly solder paste at Indium Corporation, speaks with Kelly Dack and highlights Indium’s take on three important aspects of reliability: thermal, mechanical, and electrical. He talks about challenges of all three aspects, which include solder voiding, and how Indium helps the industry address these issues through its solder paste formulations.

Two Full CFX Demo Lines at IPC APEX EXPO 2019

03/05/2019 | Dan Feinberg, Technology Editor, I-Connect007
During IPC APEX EXPO, Editor Dan Feinberg spoke with David Bergman, IPC VP of standards and technology, about CFX, IPC’s Connected Factory Exchange software for machine-to-machine communication. With more than companies now supporting CFX, IPC set up two full lines for demonstration at the show.



Copyright © 2019 I-Connect007. All rights reserved.