RTW NEPCON South China: Mycronic Discusses Industry 4.0

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At the recent NEPCON South China 2018 event in Shenzhen, Clemens Jargon, VP for Global Dispensing and Asia at Mycronic, discusses the challenges that customers face on their journey towards Industry 4.0, and how Mycronic is addressing these issues.

From jet printing to solder paste inspection, to pick-and-place, Jargon talks about their total solutions that aim to help customers take their production to the next level.

Watch the interview here.

07/16/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology

Since 2006 and the implementation of the RoHS directive, the interest in bismuth-tin solder alloys—whose melting point around 140°C is very desirable because it allows for the use of lower temperature laminate materials and reduces thermal stress on sensitive components—has only increased as the industry has searched for Pb-free alternatives to the chosen standard, SAC305, which melts at considerably higher temperatures than the incumbent tin-lead alloys.

07/15/2019 | Divyakant Kadiwala, Averatek Corporation

An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on polyester (Al-PET) substrates. This material is gaining popularity and has found wide use in RFID tags, low-cost LED lighting, and other single-layer circuits. However, both aluminum and PET have their own constraints and require special processing to make finished circuits.

07/09/2019 | Michael Gouldsmith and Zen Lee, Thermaltronics

The definition of failure is "the lack of success in doing or achieving something, especially in relation to a particular activity." If the activity is concerning a soldering process, such a failure can have a downstream impact far beyond the actual solder joint. In this regard, it is first necessary to understand what constitutes a good solder joint because appearance is too often deemed a success.