Indium Experts to Present at SMTAI 2018


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Indium Corporation experts will share their industry knowledge and skill at SMTA International from October 14-18 in Rosemont, Illinois.

The following technical papers from Indium Corporation experts will be featured:

  • Robust SMT No-Clean Solder Paste for SiP and 01005 Assembly by Dr. Ning-Cheng Lee, Vice President of Technology
  • Low-Melting Point Materials Development: Novel High Reliability Low-Temperature Solder Alloys by Dr. Ning-Cheng Lee
  • Novel High-Reliability Low-Temperature Solder Alloys by Dr. Lee
  • Process and Materials Interaction Investigation: Test Methods for Electrochemical Consistency in PCB Assembly Processes – Revisited by Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials
  • Solder Paste Rheology, Performance and Aging: How Worst-Case Shipping Scenarios Affect Solder-Paste Performance: Part 2 by Brook Sandy-Smith
  • Reflow Profiling for Next-Generation Pb-free Solder Alloys by Brook Sandy-Smith
  • Inspection Applications: Practical Implementation of Assembly Process for Low-Melting Point Solder Pastes by Brook Sandy-Smith
  • Solder Printing: Impact of Stencil Quality & Technology on Solder Paste Printing Performance by Jonas Sjoberg, Technical Manager
  • Reliability of Intermetallics in Various Interconnects: Copper-Tin Intermetallics: Their Importance, Growth Rate, and Nature by Dr. Ron Lasky, Senior Technologist

Indium Corporation experts will also serve as chairs for three technical sessions, including:

  • Solder Paste Development to Overcome Component Challenges: Adam Murling, Technical Support Engineer, Global Accounts
  • Low-Temperature Solder Paste and its Process Development – iNEMI Project: Anny Zhang, Regional Sales Manager, Northwestern USA, and Western Canada
  • Properties and Behavior of Solders Containing Bismuth: Brook Sandy-Smith

Additionally, Dr. Lee will lead a workshop on Achieving High-Reliability for Lead-Free Solder Joints – Materials Consideration, and Brook Sandy-Smith will host Rising Expectations for “High-Reliability”—a spotlight series panel discussion.

SMTAI is world-class electronics manufacturing conference and exhibition organized by the SMTA — the world's leading user group for surface mount and companion technologies. The conference provides high-quality technical information and networking opportunities.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, click here.

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Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 2)

07/24/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
In the last three to five years, there has been a resurgence of interest in the use of low melting point alloys for SMT applications. Typically, the compositions are around the eutectic bismuth-tin alloy, perhaps with additions of other elements to increase the robustness of certain alloy properties. Now, there are several new products on the market and numerous ongoing reliability projects in industry consortia.

Approaches to Overcome Nodules and Scratches on Wire-Bondable Plating on PCBs

07/17/2019 | Young K. Song and Vanja Bukva, Teledyne Dalsa Inc., and Ryan Wong, FTG Circuits
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. This paper details if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful.

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 1)

07/16/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
Since 2006 and the implementation of the RoHS directive, the interest in bismuth-tin solder alloys—whose melting point around 140°C is very desirable because it allows for the use of lower temperature laminate materials and reduces thermal stress on sensitive components—has only increased as the industry has searched for Pb-free alternatives to the chosen standard, SAC305, which melts at considerably higher temperatures than the incumbent tin-lead alloys.



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