Alpha Hosts Low-Temperature Soldering Technology Seminar in Dongguan, China


Reading time ( words)

Alpha Assembly Solutions will be hosting a full day seminar on “Low-Temperature Soldering Technology” at Hyatt Regency Dongguan in China on September 19, 2018.

Alpha Assembly Solutions, a part of the MacDermid Performance Solutions group of businesses, will share ideas and updates on how low-temperature solder alloys provide customers with efficiencies in both energy and cost. Topics will include:

  • A History and Overview of Low-Temperature Solder Alloys
  • Low-Temperature SMT Process Implementation
  • Introducing Alpha’s 3rd Generation Low-Temperature Alloy HRL1
  • How to Create Value by Using Alpha Low-Temperature Solder Paste 

In addition, Alpha’s sister company, MacDermid Enthone Electronics Solutions, is invited to present the introduction of final finished key products in PCB markets and discuss their application & case studies on DIMM wet, SMT and SAD issues.

“This seminar is to enable our southern China customers to learn the latest developments in low-temperature soldering technology and value creation of using low temperature materials,” said Andy Au Yeung, sales director of Alpha Assembly Solutions in Southern China. “It represents Alpha’s commitment to keeping our customers up-to-date on the latest solutions that help them improve their electronics assembly processes including reduction of energy cost and the associated burden on the environment.”

About Alpha Assembly Solutions

Alpha Assembly Solutions, part of the MacDermid Performance Solutions group of businesses, is the world leader in the development, manufacturing and sales of innovative specialty materials used for electronics assembly, die attach and semiconductor packaging in a wide range of industry segments, including automotive, communications, computers, consumer, power electronics, LED lighting, photovoltaics, and others.

As the electronics industry continues to evolve, Alpha is focused on developing novel and unique processes for solving assembly challenges. Whether traditional electronics assembly, die attach or emerging applications, such as flexible and formable electronics, Alpha designs solutions for manufacturing that looks at how multiple products can interact in the same environment to provide customers with the most effective assembly solution for their application.

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality materials with a focus on sustainability and recycling services. For more information, click here.

Share

Print


Suggested Items

Benefits of Jet Printing Solder Pastes

01/30/2019 | I-Connect007 Research Team
In a recent I-Connect007 survey on jet printing solder pastes, we asked the following question: "What are the major benefits with jet printing solder pastes?" Here are just a few of the replies, slightly edited for clarity.

RTW IPC APEX EXPO 2019: MacDermid Alpha Discusses New Materials to Improve Void Issues

01/30/2019 | Real Time with...IPC
Traian Cucu, Ph.D., G.A.T.E Group Leader at MacDermid Alpha Electronics Solutions, discusses with I-Connect007 Managing Editor Nolan Johnson some of the methods to reduce, or eliminate, the solder voiding issue, especially with the continuing trend towards lower-pitch, high-density components.

Mentor and Seica Partner for Data Prep and Testing Big Boards

01/18/2019 | Pete Starkey, I-Connect007
Mark Laing, business development manager of the Valor division at Mentor, a Siemens company, and Luca Corli, director of sales at Seica, speaks with I-Connect007 Technical Editor Pete Starkey about the partnership between their two companies, which enables efficient data preparation for testing big boards, and accelerates new product introduction (NPI) cycles.



Copyright © 2019 I-Connect007. All rights reserved.