BTU to Demo New WINCON Oven Control System Release at SMTAI


Reading time ( words)

BTU International, Inc. will exhibit in Booth #430 at SMTA International, scheduled to take place October 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, Illinois. At the show, the company will discuss the latest software version – WINCON 7.0. New features of the latest software release include:

  • Windows 10 compatibility
  • Profile Guardian support
  • RecipePro enhancements

BTU’s PYRAMAX reflow oven is powered by the WINCON oven control system. The PYRAMAX family is widely recognized as the performance leader in the reflow oven category. Exclusive closed-loop convection ensures process repeatability site-to-site, line-to-line and oven-to-oven regardless of altitude or other factors.  

WINCON is an advanced windows-based software system for controlling the operation of BTU thermal processing equipment. It combines both the simplicity of a graphical user interface with powerful diagnostic and analytical tools.  BTU’s WINCON oven control software supports Industry 4.0, including line control and communications, recipe development and energy savings software solutions. The company offers many solutions for line control/MES, including REST, MQTT, and PROFIBUS among others.

About BTU International

BTU International, a wholly-owned subsidiary of Amtech Group, is a global supplier and technology leader of advanced thermal processing equipment in the electronics manufacturing market. BTU’s high-performance reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes. BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications, such as brazing, direct bond copper (DBC), diffusion, sintering and advanced solar cell processing. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available here.

Share


Suggested Items

Dr. Traian Cucu Discusses Low-Temperature and Lead-Free Soldering

12/12/2018 | Happy Holden, I-Connect007
Dr. Traian Cucu, group leader of the Global Applications and Technologies Expert Group (GATE)—R&D—within Alpha Assembly Solutions, speaks with I-Connect007 Technical Editor Happy Holden about low-temperature and lead-free soldering applications, and the many critical advantages that can achieved by moving to a low-temperature process. They talk about the industry's transition to lead-free, the first, second and third generation of adoption of low-temperature alloys.

Investigation on the Assembly Process for m03015 and a Brief Look at m0201 Components

11/14/2018 | David Geiger, Robert Pennings, and Jane Feng, Flex
Components continue to shrink in the SMT world, and the next evolution of passive components includes m03015 (009005) and m0201 (008004). The m03015 and the m0201 components will see primary adoption in products that require further miniaturization, which would be SiPs. These modules would then be assembled into products through attachment, another assembly, or via other interconnect methods. This article explores the development of an assembly process (SMT only) for the m03015 component.

How to Avoid Common Wave Soldering Issues

11/13/2018 | Neil Blundell, Blundell Production Equipment
Wave soldering involves using waves of molten solder that act as glue to attach electrical components to the PCB. While this process is expedient and efficient in producing high-quality products, it sometimes experiences glitches that can be prevented or corrected. This article explores some of the main issues and how to remedy them.



Copyright © 2018 I-Connect007. All rights reserved.