AIM to Participate at Productronica South China


Reading time ( words)

AIM Solder is pleased to announce their participation at Productronica South China, scheduled to take place October 10-12, 2018 at the Shenzhen Convention Center in Shenzhen, China. AIM will highlight its REL electronic solders, REL22 and REL61, along with their full line of solder assembly materials.

AIM’s alloys provide the PCB assembly industry with unique solutions to address the limitations of current industry offerings. REL22 is an award-winning, high reliability alloy with durability characteristics that double the reliability of SAC305 in harsh environments. REL61 is a low silver solder alloy that solves the process challenges associated with many other low/no silver solder alloys. With a 10°C lower melting temperature and superior wetting performance versus SAC305, REL61 can lower process temperatures, prevent PCB damage, and reduce costs and waste. AIM’s REL alloys are available in paste, wire and bar formats and are engineered for reliability, usability, and cost effectiveness. AIM will also highlight its full line of advanced solder materials, including its solder paste, wire and liquid flux. To discover all of AIM’s products and services, visit the company at Productronica South China in booth 2C68 and speak with one of AIM’s knowledgeable staff members.

AIM Solder has operated a full-line manufacturing facility in south China for over fifteen years. In the past decade, AIM has continuously expanded its facility and support team to better address the needs of this valuable market. In light of the growing demand, AIM is opening a new facility in Changxing, China by early 2019, in efforts to expand its R&D, production capabilities, and customer support.

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here.

Share

Print


Suggested Items

Benefits of Jet Printing Solder Pastes

01/30/2019 | I-Connect007 Research Team
In a recent I-Connect007 survey on jet printing solder pastes, we asked the following question: "What are the major benefits with jet printing solder pastes?" Here are just a few of the replies, slightly edited for clarity.

RTW IPC APEX EXPO 2019: MacDermid Alpha Discusses New Materials to Improve Void Issues

01/30/2019 | Real Time with...IPC
Traian Cucu, Ph.D., G.A.T.E Group Leader at MacDermid Alpha Electronics Solutions, discusses with I-Connect007 Managing Editor Nolan Johnson some of the methods to reduce, or eliminate, the solder voiding issue, especially with the continuing trend towards lower-pitch, high-density components.

Mentor and Seica Partner for Data Prep and Testing Big Boards

01/18/2019 | Pete Starkey, I-Connect007
Mark Laing, business development manager of the Valor division at Mentor, a Siemens company, and Luca Corli, director of sales at Seica, speaks with I-Connect007 Technical Editor Pete Starkey about the partnership between their two companies, which enables efficient data preparation for testing big boards, and accelerates new product introduction (NPI) cycles.



Copyright © 2019 I-Connect007. All rights reserved.