Reading time ( words)
Zero Defects International (ZDI) will participate as an exhibitor at the annual NW Electronics Design & Manufacturing Expo on October 3 at Tektronix, 3025 SW Zworykin Ave., building no. 38, Beaverton, Oregon. Keynote addresses will feature incubator-based start-ups and a look ahead at the next 10 years in electronics manufacturing.
Among the PCB and PCBA test, inspection and production inspection products to be shown by ZDI are: Seica flying-probe ICT test systems, Europlacer pick and place equipment, Viscom AOI and XRay inspection systems, Epoch special application test boxes, Landrex ICT and functional test fixtures, Tagarno digital microscopes and Taiyo final PCB surface inspection systems. Additionally, ZDI will feature the services of Skyla, a provider of PCB front-end CAM services.
About Zero Defects International
Zero Defects International was established in 1983 and currently provides products and services throughout the world. Operations are conducted from the company’s Silicon Valley headquarters serving both the printed circuit board and the printed circuit board assembly industries.
Jens Kokott and Matthias Muller, Goepel electronic
Production runs of 10–1,000 assemblies are everyday life for an EMS provider. But what if important staff are on vacation, and component deliveries are very much delayed? And then the customer is determined to have AOI, but the layout of the assembly is highly customized, making it virtually impossible to use complete library entries. Here's how AOI programs can help you in these scenarios.
Jason Fullerton, Alpha Assembly Solutions
This paper investigates and compares the performance of no-clean liquid wave soldering fluxes using a commercially available localized extraction and cleanliness testing system, and surface insulation resistance (SIR) testing. Find out which test is suitable for your processes.
Joe Russeau, Precision Analytical Laboratory, and Mark Northrup, IEC Electronics
Industry experts are saying that Resistivity of Solvent Extract (ROSE) testing should be retired as a cleanliness or process control test in the PCB assembly industry. This article emphasizes that position by highlighting some work by the authors comparing component cleanliness results from the ROSE against Ion Chromatography (IC) results.