LiloTree’s Dr. Kunal Shah to Present at SMTA International 2018


Reading time ( words)

LiloTree’s President and Founder Dr. Kunal Shah will present a white paper called “A Novel & Cost-effective Electroless Nickel Immersion Gold (ENIG) Surface Finish for Better Reliability of Electronic Assemblies" as part of a panel discussion at this year’s SMTA International to be held on October 16 from 12:00 to 1:30 p.m. (Eastern; 11-12:30 p.m. Local).

Dr. Shah will present his paper on his National Science Foundation award winning innovative new ENIG-premium, a ground-breaking, world-changing innovation that provide better ENIG performance without cyanide. Because this product is about to be introduced to the general market, everyone interested in a much better performing ENIG (no black pads & robust solder joints) while getting rid of the cyanide and saving up to 30% on gold usage should attend this panel discussion to hear Dr. Shah talk about ENIG-premium.

Long-time industry expert, Steve Williams, had called ENIG-premium the most important technological innovation in the past 20years. “After seeing the third-party test results, I am a true believer in ENIG-premium. It performs better than traditional ENIG, including allowing for a much more controlled gold plating so that there is on average a 30% savings on gold usage. And it gets rid of that nasty cyanide. This will be good for the PCB builders and ever better for the CEMs and OEMs in terms of higher reliability who are using the boards,” said Williams.

About LiloTree

LiloTree is one of this country’s most innovative companies. They provide support and solutions for product improvements and develop materials technology for improved product performance and reliability. Their team of scientists works cohesively to provide creative technologies and solutions to support and improve your company’s products. They were awarded a National Science Foundation Grant for their development of ENIG-Premium.

For more information, click here.

Share


Suggested Items

Tips to Improve Soldering Tip Life and Reduce Cost

10/10/2018 | Thermaltronics
Whether in production, or repair and rework, the cost of soldering iron tips can be easily overlooked, but with today’s requirement for higher temperatures in lead-free solder applications, the consumption of tips has dramatically increased. This fact, combined with changes in tip design to meet the higher thermal load requirements, has also resulted in escalating tip costs, making tip care a high priority.

What SMT Component Shortages Mean for Design and Manufacturing Engineers

09/13/2018 | Russell Poppe, JJS Manufacturing
Much has been written about the increasing shortages of electronic components such as MLCCs, chip resistors and other semiconductor devices. And the manufacturing industry is now seeing price increases and greatly extended lead times. It seems the situation is likely to get rapidly worse rather than better. What can we do? Read on.

RTW NEPCON South China: Mycronic Discusses Industry 4.0

09/12/2018 | Real Time With... NEPCON South China
At the recent NEPCON South China 2018 event in Shenzhen, Clemens Jargon, VP for Global Dispensing and Asia at Mycronic, discusses I-Connect007's Edy Yu the challenges that customers face on their journey towards Industry 4.0, and how Mycronic is addressing these issues. From jet printing to solder paste inspection, to pick-and-place, Jargon talks about their total solutions that aim to help customers take their production to the next level.



Copyright © 2018 I-Connect007. All rights reserved.