LiloTree’s Dr. Kunal Shah to Present at SMTA International 2018


Reading time ( words)

LiloTree’s President and Founder Dr. Kunal Shah will present a white paper called “A Novel & Cost-effective Electroless Nickel Immersion Gold (ENIG) Surface Finish for Better Reliability of Electronic Assemblies" as part of a panel discussion at this year’s SMTA International to be held on October 16 from 12:00 to 1:30 p.m. (Eastern; 11-12:30 p.m. Local).

Dr. Shah will present his paper on his National Science Foundation award winning innovative new ENIG-premium, a ground-breaking, world-changing innovation that provide better ENIG performance without cyanide. Because this product is about to be introduced to the general market, everyone interested in a much better performing ENIG (no black pads & robust solder joints) while getting rid of the cyanide and saving up to 30% on gold usage should attend this panel discussion to hear Dr. Shah talk about ENIG-premium.

Long-time industry expert, Steve Williams, had called ENIG-premium the most important technological innovation in the past 20years. “After seeing the third-party test results, I am a true believer in ENIG-premium. It performs better than traditional ENIG, including allowing for a much more controlled gold plating so that there is on average a 30% savings on gold usage. And it gets rid of that nasty cyanide. This will be good for the PCB builders and ever better for the CEMs and OEMs in terms of higher reliability who are using the boards,” said Williams.

About LiloTree

LiloTree is one of this country’s most innovative companies. They provide support and solutions for product improvements and develop materials technology for improved product performance and reliability. Their team of scientists works cohesively to provide creative technologies and solutions to support and improve your company’s products. They were awarded a National Science Foundation Grant for their development of ENIG-Premium.

For more information, click here.

Share

Print


Suggested Items

Surface Treatment Enabling Low-Temperature Soldering to Aluminum

07/15/2019 | Divyakant Kadiwala, Averatek Corporation
An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on polyester (Al-PET) substrates. This material is gaining popularity and has found wide use in RFID tags, low-cost LED lighting, and other single-layer circuits. However, both aluminum and PET have their own constraints and require special processing to make finished circuits.

Low-temperature Solder Paste Process Advantages

10/31/2018 | Traian C. Cucu, Alpha Assembly Solutions, and Ioan Plotog and Mihai Branzei, Politechnica University of Bucharest
This article examines the performance of two low melting point SnBi alloys used in solder paste when assembling BGA components with SAC alloy spheres, and the advantages of a low-temperature process over the regular SAC assembly process. It will also evaluate solder paste capability regarding the process and the performance of a joint formed with a low melting point alloy solder paste and SAC305 spheres, including process advantages and material capabilities.

Reliability of ENEPIG by Sequential Thermal Cycling and Aging

11/06/2017 | Reza Ghaffarian, Jet Propulsion Laboratory, California Institute of Technology
Electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish for PCBs has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This article presents the reliability of LGA component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.



Copyright © 2019 I-Connect007. All rights reserved.