RTW NEPCON South China: Viscom Increases 3D AXI Throughput


Reading time ( words)

Guido Bornemann, head of sales for Asia at Viscom, speaks with Editor Edy Yu about the innovations in in-line 3D AXI systems that help manufacturers reduce handling time by about 40–50% and improve their throughputs.

Click here to watch the interview.

Share


Suggested Items

Strategies for Addressing Flex Circuit Assembly Pain Points

04/13/2017 | Stephen Las Marias, I-Connect007
In an interview with SMT Magazine, Steve Fraser, VP of Operations at Firstronic, discusses the key factors that have the greatest impact on the quality of flex circuit assemblies, the challenges they face during assembly, and their strategies to ensure the reliability of the products.



Copyright © 2018 I-Connect007. All rights reserved.