RTW NEPCON South China: Rehm Sees Growing Demand for Vacuum Soldering


Reading time ( words)

Ralf Wagenfuehr, plant manager of Rehm Thermal Systems (Dongguan) Ltd, speaks with I-Connect007’s Edy Yu about the developments in the company’s convection reflow soldering system, which features a vacuum module, aimed at addressing the increasing demand for vacuum soldering.

He also discusses their software developments, as well as how they are helping their customers toward their Industry 4.0 journey.

Watch the interview here.

Share

Print


Suggested Items

3D Optical Inspection Provides ‘Eyes’ for Process Improvements in Industry 4.0

06/21/2019 | Jenny Yuh, Koh Young Technology, and Brent Fischthal, Koh Young America
Automated 3D solder paste inspection (SPI) and 3D automated optical inspection (AOI) systems have become an integral part of the printed circuit board assembly (PCBA) process because they help ensure high-quality production. As today’s board complexity is increasing, inspection technology has become even more critical.

The Effectiveness of 75% IPA/25% DI Extraction Solution on No-clean Flux Residues

06/13/2019 | David Lober and Mike Bixenman, DBA, KYZEN; and Marietta Lemieux and Mark McMeen, STI
The continuous challenge in the electronics industry is to keep up with the demand for smaller, faster, and more reliable electronics. When it comes to cleaning, this rapid development of manufacturing and reliability challenges is juxtaposed with the slow pace of new test method development.

Reflow Your Solder and Your Data for Industry 4.0

06/11/2019 | Nolan Johnson, I-Connect007
I-Connect007 Managing Editor Nolan Johnson recently spoke with KIC President and Founder Phil Kazmierowicz and Manager of Applications and Sales MB “Marybeth” Allen as they each transitioned into new roles in the KIC leadership team. The conversation ultimately turned to the current dynamics in the industry, particularly Industry 4.0 and streamlining processes.



Copyright © 2019 I-Connect007. All rights reserved.