Reading time ( words)
Ralf Wagenfuehr, plant manager of Rehm Thermal Systems (Dongguan) Ltd, speaks with I-Connect007’s Edy Yu about the developments in the company’s convection reflow soldering system, which features a vacuum module, aimed at addressing the increasing demand for vacuum soldering.
He also discusses their software developments, as well as how they are helping their customers toward their Industry 4.0 journey.
Watch the interview here.
Nolan Johnson, I-Connect007
Based in San Francisco, Tempo Automation specializes in rapid PCB assembly and on low volume production for a wide range of board complexities. It recently held an open house at its brand-new facility in the South of Market (SoMa) district—which is normally restricted under customer non-disclosure agreements as well as International Traffic in Arms Regulations (ITAR) regulations—to customers, vendors, local designers, and government officials.
Stephen Las Marias, I-Connect007
In a recent SMT007 survey, we asked the following question: "What are your greatest challenges when it comes to soldering?" Here are just a few of the replies, slightly edited for clarity.
Jeff Leal, Gustaf Mårtensson, and Nerijus Augustis, Mycronic AB
Solder paste jetting is a technique that differs greatly from traditional solder paste deposition methods. In this article, solder paste jetting is compared with the other solder paste deposition methods—solder paste dispensing and solder paste printing and solder paste jetting—and highlights why it is becoming a viable option and how it increases the flexibility of a single production system.