TopLine Launches Low Void Solder Columns


Reading time ( words)

TopLine has announced the availability of new low-void solder columns, developed by TopLine engineers using new proprietary processes. The absence of voids in the column's high temperature core makes the columns structurally stronger and more reliable.

Martin Hart, CEO of TopLine, says that “The low-void nature of the columns isn’t visible or apparent from the exterior; the consistency exists inside the structure. These columns are stronger than ones with a higher incidence of voids, and strength is what our customers want.”  Solder columns are 10x more reliable that solder balls, he adds, when attaching large size ceramic IC packages to FR-4 or polyimide PC Boards operating in harsh environments. The large CTE (Coefficient of Thermal Expansion) mismatch of ceramic puts stress on the interconnections (I/O) over wide temperature cycles.

Eventually, the connections between the ceramic IC and the mother board will break over time after enduring thousands of temperature cycles. “Solder columns are compliant and absorb CTE mismatch, thereby lengthening the life of the circuit.”

Additionally, the new low-void solder columns exceed the requirements of Mil-STD-883K. This standard establishes uniform methods for testing microelectronic devices and components suitable for use within military and aerospace electronic systems, with an emphasis on ensuring a uniform level of quality and reliability suitable to the intended applications.

TopLine offers a wide range of solder columns to meet individual needs. Typical solder core materials include both Pb90/Sn10 as well as Pb80/Sn20.

About TopLine

TopLine manufactures a wide range of daisy chain semiconductor packages for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers.

Share

Print


Suggested Items

SMTAI 2019: Chris Bastecki on Low-temperature Solder Challenges and Products

10/14/2019 | Real Time with...SMTAI
Chris Bastecki, director of global PCB assembly at Indium Corporation, discussed challenges of low-temperature solder and the company's new product, Durafuse LT, which provides novel properties and reliability.

Real Time with... SMTAI 2019 Video Interviews

10/09/2019 | Real Time with...SMTAI
The SMTA International Conference and Exhibition 2019, which took place September 22–26, 2019, at the Donald E. Stephens Convention Center in Rosemont, Illinois, concluded successfully. For those of you who were not able to make it to the show, catch our video interviews with the movers and shakers of the electronics industry. We've updated our video presentation for a better experience for our users, so check it out!

SMTAI 2019: Happy Holden’s On-the-Scene Report

10/03/2019 | Happy Holden, I-Connect007
Last week concluded the 2019 SMTAI conference in Rosemont, Illinois. Overall, I think the show was successful and covered all aspects of SMT processes.



Copyright © 2019 I-Connect007. All rights reserved.