Xcerra’s Flagship Test Platform Brings Flexibility and Scalability to Display Driver Test


Reading time ( words)

Xcerra’s highly flexible Diamondx test platform can scale up to over 5000 display driver digitizers, supporting aggressive multi-site production strategies. With a wide range of general purpose and specialized instruments, the Diamondx platform meets the current and future test requirements of display driver devices, as well as the complete spectrum of multimedia ICs.

Touch and display driver integration (TDDI) IC shipments continue to ramp, and are expected to hit the 500 million mark in 2018 (Digitimes, March 28, 2018: https://www.digitimes.com/news/a20180328PD214.html?mod=3&q=TDDI+500&chid=9 ). Driven by bezel-less display technology popular in the latest high-end smartphone designs, TDDI chips are seeing mainstream adoption after an extended incubation period. TDDI chips offer clear benefits, such as lower cost, a thinner panel assembly, and better performance, over their discrete competitors. TDDI chips present significant challenges, however, for established display driver ATE solutions.

With the addition of the PD2x instrument, a specialized instrument designed to test leading edge display driver IC’s, the Diamondx can help realize the full potential of TDDI. With a scalable universal slot architecture, Diamondx can scale up to over 5000 display driver digitizers, supporting aggressive multi-site production strategies. Furthermore, with the introduction of the HSI1x 12.8Gbps SerDes test instrument, the Diamondx has channel count and performance headroom to meet the future needs of the display driver digital interfaces.

Christopher Lemoine, Product Marketing Director, highlights: “Traditional display driver ATE systems are specialized systems designed to test the driver row/column drivers, power management, logic and memory functions found in display driver IC’s. Adding touch controllers to these chips exposes gaps in the capabilities of existing display driver ATE, and the limited scalability of these solutions inhibits the cost benefits of TDDI. With a wide range of general purpose digital, analog, mixed-signal, wireless, and power instrumentation, the Diamondx is a well established leader in touch controller test.  With the addition of the PD2x display driver digitizer instrument and the HSI1x 12.8Gbps SerDes test instrument, the Diamondx platform enables our customers to push the boundaries of performance, quality and cost-effectiveness of their TDDI products.”

About Xcerra

Xcerra is comprised of two reporting segments; Semiconductor Test Solutions (STS) and Electronics Manufacturing Solutions (EMS). The STS segment supplies semiconductor testers, test handlers, device contactors and associated services. The EMS segment offers products and services for PCB and PCBA test as well as innovative and highly reliable interconnect components for electronic manufacturing.  The combination of these businesses creates a Company with a broad spectrum of semiconductor and PCB test expertise that drive innovative new products and services, and the ability to deliver to customers fully integrated semiconductor test cell solutions.  The Company’s products and services address the broad and divergent requirements of the mobility, automotive, industrial and consumer end markets, offering a comprehensive portfolio of solutions and technologies, and a global network of strategically deployed applications and support resources.

Share


Suggested Items

Alpha Assembly Solutions on Training, Education, and Low-Temperature Soldering

11/07/2018 | I-Connect007 Editorial Team
In this interview, Jason Fullerton of Alpha Assembly Solutions discusses the benefits and challenges of low-temperature soldering. He also highlights the biggest concerns he’s currently seeing in the industry, including young engineers lacking hands-on manufacturing experience and training, voiding and head-in-pillow issues, and low-temperature soldering demands.

Process, Design and Material Factors for Voiding Control for Thermally Demanding Applications

11/06/2018 | Ranjit Pandher, et al., Alpha Assembly Solutions
Solder voiding is a common phenomenon across all semiconductor packaging and electronic board assemblies. There are many factors that influence void frequency and size. This article focuses on several process, design and materials selection considerations which control or potentially reduce voiding to meet industry and end-market acceptance criteria.

Strengthening the Joint with a Revolutionary New Low-Temp Solder Paste

09/05/2018 | Patty Goldman, I-Connect007
I-Connect007 Editor Patty Goldman interviews one of Alpha Assembly Solution’s solder process experts, Traian Cucu, who is based at Alpha’s R&D center in New Jersey. Traian, along with Morgana Ribas, have played key roles in the development of Alpha’s innovation new low-temperature solder paste process. He also talks about how this solves many of the defects issues that one would see on a SAC assembly process.



Copyright © 2018 I-Connect007. All rights reserved.