iNEMI Presentations at SMTA International 2018


Reading time ( words)

iNEMI will be holding presentations and panel discussions on topics such as Smart Manufacturing/Industry 4.0, advanced packaging and lead-free alloys, at the upcoming SMTA International conference, which will be held on October 14–18, 2018 in Rosemont, Illinois.

For more information on the presentations and schedules, click here.

Share

Print


Suggested Items

eSMART Factory Conference 2019, Day 2

09/04/2019 | Happy Holden, I-Connect007
Happy Holden continues his report on the the eSMART Factory Conference Dearborn, Michigan, with highlights from the event's second day, which includes a keynote from Brian Toleno titled "Augmented Reality: Next-Generation Computing for Front-Line Workers."

Names to Know: Up and Comers in U.S. Congress

08/14/2019 | Ken Schramko, IPC Senior Director, North American Government Relations
When major news occurs in the U.S. Congress, you usually hear the names of top congressional leaders such as House Speaker Nancy Pelosi (D-CA) or Senate Majority Leader Mitch McConnell (R-KY).

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 1)

07/16/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
Since 2006 and the implementation of the RoHS directive, the interest in bismuth-tin solder alloys—whose melting point around 140°C is very desirable because it allows for the use of lower temperature laminate materials and reduces thermal stress on sensitive components—has only increased as the industry has searched for Pb-free alternatives to the chosen standard, SAC305, which melts at considerably higher temperatures than the incumbent tin-lead alloys.



Copyright © 2019 I-Connect007. All rights reserved.