-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Koh Young Presenting Benefits of APC with Feedback at SMTAI 2018
October 4, 2018 | Koh Young TechnologyEstimated reading time: 1 minute
David Suh, applications team leader at Koh Young Technology, will present the white paper "Combing Automated Advanced Process Control (APC) with Feedback to Revolutionize the Printed Circuit Board Assembly Process" at SMTA International 2018, to be held on October 14-18, 2018 at the Donald Stephens Convention Center in Rosemont, Illinois.
During the INS2 (Inspection 4.0) session on October 18, 2018, Suh will discuss how 3D measurement systems with closed-loop advanced process control (APC) feedback can help manufacturers improve production throughput and yield by providing performance feedback to printers and mounters—a revolutionary approach to drive process improvements. Moreover, it will show how APC will identify a trend and implement corrections by using true 3D measurement data from the SPI or AOI system. While a smart factory will help resolve the skilled employee challenge, it will also revolutionize process optimization. Additionally, Koh Young will highlight its 8030-3 3D solder paste inspection (SPI) and Zenith 3D automatic optical inspection (AOI) systems during the expo. To discover all the Koh Young products and services, visit the company at Booth 815.
If you are flying to the show, be sure to watch TalkBusiness 360 on the American Airlines in-flight entertainment system. During the entire month of October, the segment will feature Koh Young as an "Industry Innovator", highlighting its KSMART Process Optimizer. TalkBusiness will also feature Koh Young on its channel with streaming services from Apple TV, Roku, and Amazon Fire TV through December.
About Koh Young
Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, semiconductor manufacturing, machining and assembly process manufacturing, and various medical fields. In addition to the corporate headquarters in Seoul, Korea, Koh Young has established sales and support offices in Germany, Japan, Singapore, China, and the United States. The local facilities ensure Koh Young maintains close communication and support with our customers, while providing a global network to support Koh Young Technology users.
For more information, click here.
Suggested Items
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.
Inkjet Solder Mask ‘Has Arrived’
04/10/2024 | Pete Starkey, I-Connect007I was delighted to be invited to attend an interactive webinar entitled “Solder Mask Coating Made Easy with Additive Manufacturing,” hosted by SUSS MicroTec Netherlands in Eindhoven. The webinar was introduced and moderated by André Bodegom, managing director at Adeon Technologies, and the speakers were Mariana Van Dam, senior product manager PCB imaging solutions at AGFA in Belgium; Ashley Steers, sales manager at Electra Polymers in the UK; and Dr. Luca Gautero, product manager at SUSS MicroTec Netherlands.