IPC-SMTA Conference Keynotes to Feature Valuable Lessons from Industry Experts


Reading time ( words)

Industry-leading associations IPC and SMTA will jointly hold the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place November 13-15, 2018 at Chicago Marriott, Schaumburg, Illinois. The conference is focused on the cleanliness of highly dense electronic assemblies to achieve quality and reliability within the stated in-field environment.  

Matt Kelly of IBM and Dale Lee of Plexus will be the keynote presenters at the conference.

Kelly, Senior Technical Staff Member at IBM Systems, will deliver the Day 1 keynote titled, “Bottom Termination Component Technology: Guidance for Design, Assembly, Quality, and Reliability of BTC Devices.” As BTC package sizes continue to shrink, power requirements continue to increase. Reliable packages require an appropriate amount of solder paste and solder joint reliability. Other variables such as surface finish, stencil selection, cleanliness, and thermal profile are vital factors.

Lee, Senior Staff DFX Strategy Engineer at Plexus Engineering Solutions, will deliver the Day 2 keynote titled, "Designing Electronics to Survive Harsh Conditions." As devices miniaturize, there is growing concern of flux residue and its influence on reliability. When flux residue becomes trapped under low stand-off devices, it may contain an unevaporated solvent, live activators and metal complex intermediates that may impact reliability. Designing for Excellence to achieve high reliability becomes more challenging.

Come learn about these valuable lessons and more at the IPC/SMTA Cleaning and Conformal Coating Conference.

The link provides a detail agenda outline.

Share

Print


Suggested Items

SMTA Europe Webinar: What Is a Good Solder Joint, and How Can Solder Joints Be Tested?

11/18/2020 | Pete Starkey, I-Connect007
What is a good solder joint? And how can they be tested not only for purposes of process characterisation, optimisation, monitoring, and control but also for ensuring their long-term reliability? Pete Starkey details a webinar organised by the Europe Chapter of SMTA that was presented by Bob Willis, an expert in soldering, assembly technologies, and failure analysis.

IPC Standards Development: Business Challenges and an Inside View

10/28/2020 | Graham Naisbitt, Gen3 Systems
With increasing frequency, standardising the standards, such as ISO 9201, imposes certain rules that must be met to ensure “fair play” amongst the supply chain. There will be those familiar with hearing about “false positives/negatives” and “never trust the salesman,” so mitigating these is no easy task. However, there is the chance for each 5-30 Task Group to review industry requirements and set out the work program for the ensuing period. With that in mind, much of what follows is based on comments we learn about from our industry around the world, many of whom are not yet IPC members. Yes, this is a membership recruitment drive, unashamedly, as well as a search for volunteers willing to help create the standards of tomorrow.

How to Benefit From Robotic Soldering Processes

10/28/2020 | Pete Starkey, I-Connect007
Webinars are in vogue! But in Pete Starkey's experience, the master of the technical webinar with many years’ experience of delivering first-rate events is Bob Willis—electronics assembly specialist, soldering expert, and provider of training and consultancy in electronics manufacture. Here, Pete recaps Bob’s presentation on the upcoming robotic soldering experience.



Copyright © 2020 I-Connect007. All rights reserved.