Nordson SELECT to Exhibit Award Winning Selective Soldering Technology at SMTAI


Reading time ( words)

Nordson SELECT, a Nordson company, is pleased to announce it will exhibit its award-winning selective soldering technologies in Booth 410 at the SMTA International 2018, scheduled to take place October 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, Illinois.

On exhibit will be the Cerno 103IL a fully-configured SMEMA compatible selective soldering system equipped with standard features including interchangeable solder pots and pumps compatible with tin-lead, lead-free and HMP solder alloys.  The Cerno 103IL comes standard with an automated fiducial location and correction system that provides single click fiducial teach capability, seamless fiducial recognition and true automated alignment and skew correction of a printed circuit board. Also available is an optional in-line flux and preheat module with concurrent fluxing and preheating that provides significantly increased production throughput.

Also on display will be the Novo 300 which is an entry level selective soldering platform with a compact footprint requiring less than 1.1 square meters of factory floor space.  The Novo 300 is a standalone platform that is ideally suited for prototype, cell manufacturing or small batch production. The Novo 300 has a full titanium solder pot compatible with all solder alloys plus easy tool-free maintenance, and has the capability to solder printed circuit boards at the same speed as larger more expensive machines.

About Nordson SELECT

Nordson SELECT, is a leading worldwide supplier of selective soldering systems including Novo standalone machines offering exceptional value and superior process capability ideal for batch production, Cerno in-line systems delivering uncompromised quality and productivity for demanding soldering applications, and Integra multi-station modular systems designed to meet the most challenging high-volume requirements by combining parallel processing with multiple soldering nozzles for the ultimate in flexibility and maximum throughput.  To find out more, click here.

About Nordson Corporation

Nordson Corporation engineers, manufactures and markets differentiated products and systems used to dispense, apply and control adhesives, coatings, polymers, sealants, biomaterials, and other fluids, to test and inspect for quality, and to treat and cure surfaces.  These products are supported by application expertise and direct global sales and service.  Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in nearly 40 countries.  Visit Nordson on the web here.

Share

Print


Suggested Items

Optimizing Solder Paste Volume for Low-Temperature Reflow of BGA Packages

07/22/2019 | Keith Sweatman, Nihon Superior Co. Ltd
In this article, Keith Sweatman explains how the volume of low-melting-point alloy paste—which delivers the optimum proportion of retained ball alloy for a particular reflow temperature—can be determined by reference to the phase diagrams of the ball and paste alloys.

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 1)

07/16/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
Since 2006 and the implementation of the RoHS directive, the interest in bismuth-tin solder alloys—whose melting point around 140°C is very desirable because it allows for the use of lower temperature laminate materials and reduces thermal stress on sensitive components—has only increased as the industry has searched for Pb-free alternatives to the chosen standard, SAC305, which melts at considerably higher temperatures than the incumbent tin-lead alloys.

Surface Treatment Enabling Low-Temperature Soldering to Aluminum

07/15/2019 | Divyakant Kadiwala, Averatek Corporation
An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on polyester (Al-PET) substrates. This material is gaining popularity and has found wide use in RFID tags, low-cost LED lighting, and other single-layer circuits. However, both aluminum and PET have their own constraints and require special processing to make finished circuits.



Copyright © 2019 I-Connect007. All rights reserved.