MIRTEC to Exhibit 3D AOI and SPI Systems at SMTA Guadalajara


Reading time ( words)

MIRTEC plans to exhibit its award-winning MV-6 OMNI 3D AOI System and MS-11e 3D SPI Machine at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place November 14-15, 2018 at the Expo Guadalajara.

The award-winning MV-6 OMNI 3D AOI Machine is configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology that combines the 15 Mega Pixel CoaXPress Camera Technology with MIRTEC’s revolutionary 8 Projection Digital Multi-Frequency Moiré 3D system in a newly designed cost-effective platform. MIRTEC’s 15 Mega Pixel CoaXPress Vision System is a proprietary camera system designed and manufactured by MIRTEC for use with our complete product range of 3D inspection systems. MIRTEC’s 8 Projection Digital Multi-Frequency Moiré Technology, provides true 3D inspection to yield precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured the MIRTEC MV-6 OMNI machines feature four (4) 10 Mega Pixel Side-View Cameras in addition to a 15 Mega Pixel Top-Down Camera.

MIRTEC2.jpgMIRTEC’s award-winning MS-11e 3D SPI Machine is configured with an exclusive 15 Mega Pixel CoaXPress Camera System, providing enhanced image quality, superior accuracy and incredibly fast inspection rates.

The MS-11e uses Dual Projection Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste depositions on PCBs post screen print for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. The MS-11e uses the same robust platform as MIRTEC’s MV-6 OMNI Series.

About MIRTEC

MIRTEC is a leading global supplier of automated inspection systems to the electronics manufacturing industry. For further information, please click here.

Share

Print


Suggested Items

The Future of the Customer Experience in Mobility

01/16/2019 | Nolan Johnson, I-Connect007
Based on the protocol stack that starts with 5G, moves up to AI, and continues to layer integrations and user interfaces and experiences on top of those lower-level technologies, how does this all apply to the current mobile experience? A panel on the future of mobility with representatives from several major companies covered this and more at CES.

Dispatches from CES 2019: The Future in the Kickoff

01/14/2019 | Nolan Johnson, I-Connect007
Press kickoff briefings at the Consumer Electronics Show (CES) are no stranger to big claims and hyperboles. At the “CES 2019 Trends to Watch” presentation on Monday morning, Steve Koenig, Consumer Technology Association’s (CTA’s) VP of market research, made some pretty big claims about what we should expect to see at the show, but those claims don't seem at all to be hyperbolized.

Words of Advice

01/02/2019 | Stephen Las Marias, I-Connect007
In our recent designer survey, we asked the following question: “What advice would you give an OEM system designer?” Here’s what our EMS experts said.



Copyright © 2019 I-Connect007. All rights reserved.