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The High-Reliability Cleaning and Conformal Coating Conference, co-organized by industry-leading associations IPC and SMTA, will take place from November 13–15, 2018 at Chicago Marriott in Schaumburg, Illinois. The conference will highlight the cleanliness of highly dense electronic assemblies to achieve quality and reliability within the stated in-field environment.
Session 2 of the technical conference focuses on "Conformal Coating Highly Dense Electronics."
Devyn DeVantier of Northrop Grumman Corporation will discuss "Adapting Coating Applications for High-Density Electronics."
David Hillman of Rockwell Collins will discuss the "Round Robin Testing for IPC Conformal Coating Material & Application Assessment – Interim Report."
Nico Coenen of Plasmatreat will discuss "Open Air Plasma Treatment Before Conformal Coating."
Rakesh Kumar, Ph.D. of Specialty Coating Systems will discuss "Increasing Protection and Reliability of High Dense Electronics Through Paraylenes."
Click here for the detailed agenda outline.