RTW SMTAI: KYZEN's Forsythe Discusses Gap in Cleaning Knowledge

Reading time ( words)

At the recent SMTA International 2018, Tom Forsythe, executive vice president of KYZEN Corp., busts myths around "how-clean-is-clean." He discusses the increasing cleaning challenges as devices get more dense and form factors become even smaller, and how these trends are driving the need for cleaning and causing a gap in cleaning knowledge.

He also speaks about their new products in data collection and monitoring software for cleaning equipment.

Watch the interview here.

04/17/2019 | Jason Fullerton, MacDermid Alpha Electronics Solutions

Solder joints that form properly are not expected to exhibit reduced reliability. However, a higher number of defects created tends to lead to a higher chance that defective connections escape detection through inspection and functional testing, and that’s not a risk to be taken lightly.

04/08/2019 | Neil Sharp, JJS Manufacturing

For many EMS providers, IPC-A-610 is the agreed standard to define what's acceptable and what's not in the world of PCBA production. As an OEM, it's important that you're clear on the basic principles that separate those classes so that you have a clear and realistic expectation of what the results are going to be.

04/03/2019 | Tim Haag and Barry Matties, I-Connect007

At PCB West in Santa Clara, California, Dr. Bill Cardoso of Creative Electron held a class on advanced packaging and X-ray inspection strategy. Guest Editor Tim Haag and Publisher Barry Matties met with Bill to further discuss his class and the importance of turning inspection data into information.