RTW SMTAI: KYZEN's Forsythe Discusses Gap in Cleaning Knowledge


Reading time ( words)

At the recent SMTA International 2018, Tom Forsythe, executive vice president of KYZEN Corp., busts myths around "how-clean-is-clean." He discusses the increasing cleaning challenges as devices get more dense and form factors become even smaller, and how these trends are driving the need for cleaning and causing a gap in cleaning knowledge.

He also speaks about their new products in data collection and monitoring software for cleaning equipment.

Watch the interview here.

Share




Suggested Items

Real Time with... IPC APEX EXPO 2023: PCBA Cleaning Trends

02/08/2023 | Real Time with...IPC APEX EXPO
Tom Forsythe of KYZEN talks with Nolan Johnson about cleaning trends as well as the launch of their newest addition to their AQUANOX line, the A4626 cleaning chemistry, and how pairing it with KYZEN PCS can increase yields and reliability.

KYZEN Comes Clean For SMTAI

10/19/2022 | Andy Shaughnessy, I-Connect007
In this interview, KYZEN Executive Vice President Tom Forsythe explains his company’s plans for the upcoming SMTA International show in Minneapolis, Minnesota, Oct. 31-Nov. 3. He discusses KYZEN’s latest aqueous cleaning chemistries and the company’s focus on providing reliable cleaning equipment and accurate data for customers. "This is the latest in that expanded envelope, with better economics, and better environmental health and safety," he says. "It's all part of this trend of always trying to be a better product and deliver better value.

How to Minimize Quoting Time and Increase Accuracy in EMS Production

03/30/2022 | Mark Laing, Siemens Digital Industries Software
New product introductions (NPIs) and customization have been increasing rapidly over the past few years—with the results that the already-small profit margins in electronics assembly are shrinking even further. Fifteen years ago, the PCB was the product. Today, most products are a system, with multiple PCBs, cables, and enclosures. Many manufacturers want to provide turn-key products that have multiple BOMs, making the assembly process even more complicated.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.