RTW SMTAI: KYZEN's Forsythe Discusses Gap in Cleaning Knowledge

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At the recent SMTA International 2018, Tom Forsythe, executive vice president of KYZEN Corp., busts myths around "how-clean-is-clean." He discusses the increasing cleaning challenges as devices get more dense and form factors become even smaller, and how these trends are driving the need for cleaning and causing a gap in cleaning knowledge.

He also speaks about their new products in data collection and monitoring software for cleaning equipment.

Watch the interview here.

07/03/2019 | Dudi Amir and Brett Grossman, Intel Corporation

This article describes the details of a study of assembling SiP BGA packages into a cavity. It points out the challenges involved in the board cavity design and assembly of components in a cavity. The authors discussed the board design challenge of having a cavity and defining the proper depth of the cavity to accommodate the board fabricator, the product design, and the SMT assembly.

07/03/2019 | Russell Poppe, JJS Manufacturing

Although IPC suggests clear guidelines, agreeing on the cleanliness (or otherwise) of a PCB assembly can often be a subjective and even contentious subject within the electronics manufacturing industry. If you’ve chosen to outsource your assemblies, how do you decide what to specify to your EMS partner? Find out here.

04/17/2019 | Jason Fullerton, MacDermid Alpha Electronics Solutions

Solder joints that form properly are not expected to exhibit reduced reliability. However, a higher number of defects created tends to lead to a higher chance that defective connections escape detection through inspection and functional testing, and that’s not a risk to be taken lightly.