Indium to Feature New Solder Paste at SMTA Guadalajara


Reading time ( words)

Indium Corporation will help attendees Avoid the Void by featuring its ultra-reliable Indium8.9HF Solder Paste series at SMTA Guadalajara Technical Forum and Expo, November 14-15 in Guadalajara, Mexico.

Indium8.9HF is an air reflow, no-clean solder paste that has been tested and approved for use in the automotive electronics industry.

The Indium8.9HF series enhances the reliability of automotive products in three ways:

  • Improves thermal conductivity and thermal reliability with industry-proven low-voiding performance
  • Enhances mechanical reliability, which allows for stable and consistent performance under harsh environments
  • Provides higher electrical reliability with an enhanced SIR

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, click here.

Share

Print


Suggested Items

Advancement of SPI Tools to Support Industry 4.0 and Package Scaling

08/06/2019 | A. Prasad, L. Pymento, S.R. Aravamudhan, and C. Periasamy, Intel Corp.
This paper evaluates the current state of inline SPI tools from multiple vendors for solder paste measurement accuracy and capability. It discusses a measurement capability analysis that was carried out against a golden metrology tool across a range of volume deposits, and highlights the results from the study.

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 2)

07/24/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
In the last three to five years, there has been a resurgence of interest in the use of low melting point alloys for SMT applications. Typically, the compositions are around the eutectic bismuth-tin alloy, perhaps with additions of other elements to increase the robustness of certain alloy properties. Now, there are several new products on the market and numerous ongoing reliability projects in industry consortia.

The Four Things You Need to Know About Test

07/24/2019 | Neil Sharp, JJS Manufacturing
The electronics manufacturing process can often be extremely complex, and the costs associated with product recalls can be astronomical. A robust approach to test is key to ensuring the quality of your product and the satisfaction of your end user.



Copyright © 2019 I-Connect007. All rights reserved.