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At the IPC’s APEX EXPO, Zymet will be featuring a reworkable edgebond adhesive that has recently been shown to be capable of significantly enhancing the board level reliability (BLR) of low temperature solder (LTS) assemblies. Low temperature solders are the subject of growing interest for their ability to reduce energy consumption, reduce warpage and increase assembly yields, and as a path to more complex assemblies. Though the BLR of LTS assemblies can be quite good, there are still packages that do not perform well enough on their own, particularly in high reliability or harsh environment applications. Using an underfill to overcome deficient BLR performance is a less-than-ideal process, requiring board preheat to facilitate underfill flow, dwell times to wait for underfill flow, while yielding encapsulation outcomes that cannot be 100% verified by AOI. Edgebonding, on the other hand, is quick and completely verifiable. Figure 1 illustrates the use of an edgebond adhesive both in a corner-only configuration and in a full-edgebond configuration. Both configurations enhance BLR. The reworkable edgebond adhesive also enhances the mechanical shock or drop test reliability of assemblies.
Zymet welcomes visitors to stop by its booth to collect more information or to discuss the use of reworkable edgebond adhesives. Representatives of Zymet will be at booth #1350, APEX EXPO 2019, January 29- 31, 2019, at the San Diego Convention Center, Sand Diego, California, USA.
Zymet is a global supplier of adhesives and encapsulants, focused on the development and manufacture of enabling materials for the electronics industry.