Session 4 of IPC/SMTA Hi-Rel Conference to Focus on Harsh Environment Cleaning


Reading time ( words)

IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place November 13-15, 2018 at the Chicago Marriott, Schaumburg, Illinois. The conference is focused on the cleanliness of highly dense electronic assemblies to achieve quality and reliability within the stated in-field environment.  

Session 4 of the Technical Conference focuses on “Class 3 Electronics – Electronic Cleanliness needed to Survive within Harsh Environments.”  

Michael Konrad of Aqueous Technologies will present “Improving Reliability of Circuit Assemblies in Harsh Environments.”

Brian Madsen, Ph.D., of Continental Corporation will present on “Cleanliness in an Automotive Manufacturing Environment.”

Tana Soffa of Northrop Grumman Missile Systems will present “Replacing Vapor Degreasing for Difficult to Clean Assemblies.”

Sung-Hyung Lim of the BuhmwooInstitute of Technology Research will present on “Characterization of an Environmentally Friendly Conformal Coating Solution based on Waterborne Polyurethane Dispersion containing Fluorine.”

Come learn about these valuable lessons and more at the IPC/SMTA Cleaning and Conformal Coating Conference.

Click here for the detailed agenda outline.

Share

Print


Suggested Items

One Fish, Two Fish, Red Fish, Blue Fish: Same Industry, New Look

05/22/2020 | I-Connect007 Research Team
Learning a lesson from challenges is one thing, but implementing changes based on those lessons is quite another. I-Connect007 regularly surveys leaders in the electronics industry to bring you important and relevant information that helps you make better decisions. What lessons have you learned during the COVID-19 crisis, and what changes have you made?

Process Ionic Contamination Test (PICT) Standard Roundtable With Industry Experts

04/22/2020 | I-Connect007
With standards committees set to release the first of four new test standards, industry experts discussed the process ionic contamination test (PICT) standard, which was recently approved by the IEC for publication. Roundtable participants included Teresa Rowe, senior director of assembly and standards technology at IPC, Graham Naisbitt, chairman and CEO of Gen3, Jason Keeping, corporate process development at Celestica, and Doug Pauls, principal materials and process engineer at Collins Aerospace.

SMTA Europe’s Electronics in Harsh Environments Conference and Exhibition: A Taste of Things to Come

04/14/2020 | Pete Starkey, I-Connect007
SMTA Europe’s Electronics in Harsh Environments Conference has become a must-attend annual event; unfortunately, it also became another casualty of the COVID-19 lockdown. Scheduled to take place in Amsterdam, the Netherlands, from April 21–23, 2020, it has now been postponed until December 1–3. Pete Starkey reports on a preview seminar presented by SMTA Europe.



Copyright © 2020 I-Connect007. All rights reserved.