AIM to Participate in SMTA Silicon Valley


Reading time ( words)

AIM Solder will participate in the upcoming SMTA Silicon Valley Meeting taking place on November 28, 2018 at the Bestronics Box Build Factory in San Jose, California. AIM Solder will highlight its REL electronic solders, REL22 and REL61.

AIM’s alloys provide the PCB assembly industry with unique solutions to address the limitations of current industry offerings. REL22 is an award-winning, high reliability alloy with durability characteristics that double the reliability of SAC305 in harsh environments. REL61 is a low silver solder alloy that solves the process challenges associated with many other low/no silver solder alloys. With a 10°C lower melting temperature and superior wetting performance versus SAC305, REL61 can lower process temperatures, prevent PCB damage, and reduce costs and waste. AIM’s REL alloys are available in paste, wire and bar formats and are engineered for reliability, usability, and cost effectiveness.

Along with their REL alloys, AIM will showcase its full line of advanced solder materials, including its solder pastes, liquid fluxes, tin/lead and lead-free alloys. To discover all of AIM’s products and services, visit the company at the SMTA  Silicon Valley Meeting for more information and to speak with one of AIM’s knowledgeable staff members. 

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here.

Share

Print


Suggested Items

Advancement of SPI Tools to Support Industry 4.0 and Package Scaling

08/06/2019 | A. Prasad, L. Pymento, S.R. Aravamudhan, and C. Periasamy, Intel Corp.
This paper evaluates the current state of inline SPI tools from multiple vendors for solder paste measurement accuracy and capability. It discusses a measurement capability analysis that was carried out against a golden metrology tool across a range of volume deposits, and highlights the results from the study.

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 2)

07/24/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
In the last three to five years, there has been a resurgence of interest in the use of low melting point alloys for SMT applications. Typically, the compositions are around the eutectic bismuth-tin alloy, perhaps with additions of other elements to increase the robustness of certain alloy properties. Now, there are several new products on the market and numerous ongoing reliability projects in industry consortia.

The Four Things You Need to Know About Test

07/24/2019 | Neil Sharp, JJS Manufacturing
The electronics manufacturing process can often be extremely complex, and the costs associated with product recalls can be astronomical. A robust approach to test is key to ensuring the quality of your product and the satisfaction of your end user.



Copyright © 2019 I-Connect007. All rights reserved.