Kurtz Ersa Picks Up Award for Selective Soldering at SMTA Guadalajara


Reading time ( words)

Kurtz Ersa Inc. was awarded a 2018 Mexico Technology Award in the category of Soldering - Selective for its VERSAFLOW 455. The award was presented to the company during a Wednesday, November 14, 2018 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.

Ersa Vice President of Sales – North America, Ernie Grice stated, “The VERSAFLOW 4/55 demonstrates Kurtz Ersa’s ongoing reaction to the market’s demands for flexibility and throughput. In the changing environment of low-mix to high-volume and high-mix to low-volume, the VERSAFLOW 4/55 has almost an endless configuration of possibilities to meet requirements. We are very pleased to be recognized with this award.”

Ersa presents the future of selective soldering technology with the VERSAFLOW 455, featuring a maximum process window for board assemblies of 508 x 508 mm. This modular selective soldering system can be configured with two fluxer modules, multiple preheat units including upper preheaters and up to three soldering modules.

The wave of innovations continues in the solder module. The Y- and Z- variable solder pots, up to now only available as separate options, are now combined and controllable in the VERSAFLOW 4 software. The parameter Y-variable adjusts the distance of the two solder baths / nozzles automatically to that of the individual boards in a multiple-up. Different multiple-ups with differing offsets can now be processed in mixed production without manual intervention and without loss of time! Also available is the programmable Y-variable for the fluxer. The option Z-variable serves to solder a PCB with two nozzles of different sizes.

The Mexico Technology Awards recognize the best new innovations in the electronics manufacturing industry in Mexico. The goal of the award program is to celebrate the companies and people that are achieving the highest standards and driving the industry forward.

For more information about Kurtz Ersa North America, click here.

Share

Print


Suggested Items

What’s Driving AOI Innovation and Collaboration?

03/25/2020 | Brent Fischthal, Koh Young America
When we look at the optical inspection market growth trajectory, we can see how process challenges helped create innovations. For example, solder paste inspection (SPI) has undergone a shift from 2D to 3D because the 2D inspection technologies manufacturers traditionally used to collect solder deposit images could not solve shadowing problems. Thus, companies developed 3D SPI to capture the printed solder paste height to accurately measure the total volume of paste printed. Several years later, we see the same need for surface-mounted component inspection with AOI systems.

AIM Appoints Oscar Hernandez as Sales Manager for Queretaro and Bajio Regions Mexico

03/24/2020 | AIM Solder
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of Oscar Hernandez to the position of Sales Manager for the Queretaro and Bajio regions of Mexico.

Trends From the Show: Solder and Software

03/18/2020 | Nolan Johnson, I-Connect007
In my role as a media representative, my perspective on IPC APEX EXPO may be a bit different from that of many attendees. Since the I-Connect007 team had the opportunity to talk to many attendees and exhibitors and listen to their stories over the course of the week, our view can be particularly wide. When I reflected on all the conversations, pieces from all throughout the week coalesced and provided a different understanding of and takeaway from the show.



Copyright © 2020 I-Connect007. All rights reserved.