Viscom Wins Mexico Technology Award for Automatic 3D X-ray System


Reading time ( words)

Viscom was awarded a 2018 Mexico Technology Award in the category of Inspection Equipment – X-ray for its X7056-II automatic 3D X-ray inspection system. The award was presented to the company during a Wednesday, Nov. 14, 2018 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.

The X7056-II automatic 3D X-ray inspection system features extremely high throughput and superb image quality for the requirements in high-end electronics production. This new AXI in-line system can ensure precise inspection of hidden solder joints and components in production, including µBGA HIP (head in pillow) defects on bumps down to 0.2mm Ø.

The system is equipped with the xFastFlow transport module, which cuts printed circuit board transfer times. With this feature, up to three boards can be processed at the same time.

The Mexico Technology Awards recognize the best new innovations in the electronics manufacturing industry in Mexico. The goal of the award program is to celebrate the companies and people that are achieving the highest standards and driving the industry forward.

About Viscom

Viscom AG develops, manufactures and sells high-quality inspection systems. The portfolio encompasses the complete bandwidth of optical and X-ray inspections. In the area of assembly inspection for electronics manufacturing, the company is among the leading suppliers worldwide. Viscom systems can be configured specific to the customer and can be interlinked. The company headquarters and manufacturing location is in Hanover, Germany. With a wide network of branches, applications centers, service support points and representatives, Viscom is represented internationally. Founded in 1984, since 2006 Viscom has been listed on the Frankfurt Stock Exchange (ISIN: DE0007846867). For additional information, click here.

 

Share

Print


Suggested Items

Defense Speak Interpreted: PERM—Pb-free Electronics Risk Management

12/18/2018 | Dennis Fritz, Fritz Consulting
In this column, we explore PERM—the Pb-free Electronics Risk Management Consortium. No, the group members do not all have curly hair! The name was chosen around 2008 by a group of engineers from aerospace, defense, and harsh environment (ADHE) organizations.

Greatest Challenges in Soldering

12/12/2018 | Stephen Las Marias, I-Connect007
In a recent SMT007 survey, we asked the following question: "What are your greatest challenges when it comes to soldering?" Here are just a few of the replies, slightly edited for clarity.

Dr. Traian Cucu Discusses Low-Temperature and Lead-Free Soldering

12/14/2018 | Happy Holden, I-Connect007
Dr. Traian Cucu, group leader of the Global Applications and Technologies Expert Group (GATE)—R&D—within Alpha Assembly Solutions, speaks with I-Connect007 Technical Editor Happy Holden about low-temperature and lead-free soldering applications, and the many critical advantages that can achieved by moving to a low-temperature process. They talk about the industry's transition to lead-free, the first, second and third generation of adoption of low-temperature alloys.



Copyright © 2018 I-Connect007. All rights reserved.