A Look at Our Readers’ Manufacturing Challenges


Reading time ( words)

In a recent SMT007 survey, we asked the following question: "What are your greatest challenges when it comes to soldering?" Here are just a few of the replies, slightly edited for clarity.

Jon Ashton, Vergent Products: Selective soldering is not covered (as a process) by any specific IPC/J-STD document that I can find. The training, even from our equipment supplier, is prohibitively expensive. That makes improving the process harder than it should be. Regarding SMT PCBA design, there is a lot of bad data out there in existing CAD/CAM libraries, and the manufacturer’s datasheets are often the source of this bad information.

Jeff Vaessen, Borg Indak: Choosing the right tip geometry is the biggest challenge for any solderer. The right tip makes all the difference in the world.

Pongtip Pattarateerawat, Celestica Thailand: The wave soldering process is more challenging than the SMT reflow process, as there are a variety of PCB design and component considerations when it comes to wave soldering.

Yingyos Sookchai, SVI Public Co. Ltd: Achieving solder fillets with perfect wetting and avoiding damages to components.

Share

Print


Suggested Items

The Effectiveness of 75% IPA/25% DI Extraction Solution on No-clean Flux Residues

06/13/2019 | David Lober and Mike Bixenman, DBA, KYZEN; and Marietta Lemieux and Mark McMeen, STI
The continuous challenge in the electronics industry is to keep up with the demand for smaller, faster, and more reliable electronics. When it comes to cleaning, this rapid development of manufacturing and reliability challenges is juxtaposed with the slow pace of new test method development.

Reflow Your Solder and Your Data for Industry 4.0

06/11/2019 | Nolan Johnson, I-Connect007
I-Connect007 Managing Editor Nolan Johnson recently spoke with KIC President and Founder Phil Kazmierowicz and Manager of Applications and Sales MB “Marybeth” Allen as they each transitioned into new roles in the KIC leadership team. The conversation ultimately turned to the current dynamics in the industry, particularly Industry 4.0 and streamlining processes.

Laserssel Brings High-speed Soldering to New Application Areas

06/10/2019 | Barry Matties, I-Connect007
In this interview with I-Connect007, Denis Barbini, general manager of Laserssel, talks about the company's new laser-selective reflow solution aimed at reducing a typical reflow oven’s 10-minute cycle down to just 10 seconds as well as the overall benefits manufacturers could see from streamlining this process.



Copyright © 2019 I-Connect007. All rights reserved.