New NPL Webinar Titles for 2019


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The Electronics Interconnection Group’s webinars are now in their 8th year. The Group is internationally recognised for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker migration and conformal coating research

The team investigate interconnect properties and develop metrological techniques to characterise performance, frequently in multiple domains. Our research is focused on the emerging technologies within printed electronics, harsh and high temperature electronics, wearable technology and electrochemical performance in coating barrier systems

Increasing the Performance of Organic PCBs at Higher Temperatures
17th January

Organic Hybrids for Circuit Assemblies – Initial Environmental Testing of a Low Cost Alternative to Ceramic Substrate Based Assemblies
19th March

Evaluation Of Embedded Electronics For Use In Harsh Environments
21st May

Effect of Bias (up to 1000V) on Conductive Anodic Filament (CAF) Failures of Electronic Circuits
16th July

Electrical and Thermal Material Evaluation Using Power Cycling Testing For Power Electronic Applications
17th September

Battery Metrology At NPL – Lithium Ion Cell Characterisation
12th November

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