Indium Solder Paste Wins Mexico Technology Award


Reading time ( words)

Indium Corporation has won the Mexico Technology Award for its Indium10.1HF solder paste.

The Mexico Technology Awards, sponsored by Mexico EMS, recognizes the best electronics manufacturing innovations in the electronics manufacturing industry in Mexico produced by OEM manufacturing equipment and materials suppliers over the last year.

The awards are designed to promote best practices in technical innovation, manufacturing quality, and productivity by celebrating the companies and people achieving high standards and driving the industry forward.

Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste specifically formulated to achieve ultra-low voiding, especially in bottom termination component (BTC) assemblies.

In addition to the ultra-low voiding, Indium10.1HF is engineered with a unique flux chemistry to improve reliability and address the challenges of the industry’s trend toward miniaturization, including:

  • High ECM performance under low standoff components, RF shields without proper ventilation, and components in low-clearance cavities
  • Solder beading minimization
  • Very low bridging, slump, and solder balling
  • Excellent wetting to a variety of common fresh and aged metallizations and surface finishes
  • High print transfer efficiency with low variation 

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA. 

For more information about Indium Corporation, click here

Share

Print


Suggested Items

IPC Electronics Materials Forum 2019

10/16/2019 | IPC
IPC will be holding its Electronics Materials Forum 2019 from November 5–7, 2019, in Bloomington, Minnesota. The Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing.

SMTAI 2019: Lenora Clark Discusses Company Changes and Her New Role

10/02/2019 | Real Time with...SMTAI
Lenora Clark, director of autonomous driving and safety technology at MacDermid Alpha Electronics Solutions (and co-organizer for the upcoming SMTA Additive Electronics Conference), and Nolan Johnson discuss her new role, recent company reorganization, and the synergies customers are seeing.

Combating ESD: The Silent Assassin in Electronics Manufacturing

09/20/2019 | Neil Sharp, JJS Manufacturing
ESD is a constant but invisible force within electronics manufacturing that can have a powerfully detrimental impact on production yield, product and product reliability, and company profitability. And as the circuitry within electronic devices continues to get faster, smaller, and more sophisticated, their sensitivity to the effects of ESD is only likely to increase.



Copyright © 2019 I-Connect007. All rights reserved.