Reading time ( words)
Alpha Assembly Solutions is participating in the upcoming Intersolar India taking place December 11–13, 2018, in Bangalore, India.
Narahari Pujari, R&D manager for Alpha Assembly Solutions, part of the MacDermid Performance Solutions group of businesses, will present a technical paper on a review of interconnection technology for floating PV applications that critically assesses various cell designs, material and techniques to join cells for floating PV assemblies.
"It is reported that 40.7% of cSi PV (photovoltaic) modules fail at interconnection in a module’s lifespan. This risk is even higher in floating PV applications. This is due to high moisture content and corrosion resulting from adverse environmental conditions as well as instability in times of inclement weather, hazardous condensation in the interior, etc.," said Pujari. "Additionally, joints that are exposed to fatigue loading and vibrations have shown metal segregation, grain boundary coarsening/cracking, increased series resistance and heating issues. The industry is still evaluating interconnection options in new cell designs. All these make the review of interconnection technologies employed in floating PV imperative."
Pujari's paper will demonstrate the role of non-corrosive flux and EVA compatibility studies. In addition, use of lead-free soldering and solder paste technologies to support the current design trend of new cell architectures will be presented. Both options are cost efficient and could improve the module performance and consequently extend the mean-time-to-failure (MTTF).
2018 Intersolar India
Date: Tuesday December 11, 2018 – Thursday December 13, 2018
Venue: Bangalore, India
Presentation: A Review of Interconnection Technologies for Floating PV Application
Date: December 12, 2018
Time: 11:35 am
Presented by: Narahari Pujari, R&D manager, Alpha Assembly Solutions